Tag Archives: Zen

AMD AM5+ Platform Mentioned With Two Granite Ridge “Ryzen Zen 5” CPUs In Microcode Extraction Tool – Wccftech

  1. AMD AM5+ Platform Mentioned With Two Granite Ridge “Ryzen Zen 5” CPUs In Microcode Extraction Tool Wccftech
  2. AMD may have a new platform for upcoming Ryzen CPUs — AM5+ socket and Granite Ridge CPUs listed in a microcode extraction tool Tom’s Hardware
  3. The launch of AMD’s Zen 5 processors is close, as motherboard manufacturers begin rolling out BIOSes supporting the next-gen chips PC Gamer
  4. ASUS X670 AGESA 1.1.7.0 update enables initial support for Zen5 “Granite Ridge” CPU series VideoCardz.com
  5. AMD Zen 5 Architecture to Introduce Enhanced 512-bit Floating Point Unit guru3d.com

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Ubuntu Linux Squeezes ~20% More Performance Than Windows 11 On New AMD Zen 4 Threadripper Review – Phoronix

  1. Ubuntu Linux Squeezes ~20% More Performance Than Windows 11 On New AMD Zen 4 Threadripper Review Phoronix
  2. Ubuntu runs 20% faster than Windows 11 on AMD’s new 96-core Ryzen Threadripper Pro 7995WX, demonstrating once more that Linux loves high core count CPUs Tom’s Hardware
  3. AMD’s 96-Core Ryzen Threadripper Pro 7995WX Hits 6.0 GHz on All Cores with LN2 AnandTech
  4. Extreme Overclocking with Liquid Nitrogen – AMD Ryzen Threadripper 7000 Series StorageReview.com
  5. AMD Ryzen Threadripper 7980X Review A Funky Workstation CPU Some Will LOVE ServeTheHome
  6. View Full Coverage on Google News

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Efficient Intel Meteor Lake described as “Zen 4 Phoenix Killer” as leak claims Intel is working on a 40-core Arrow Lake CPU – Notebookcheck.net

  1. Efficient Intel Meteor Lake described as “Zen 4 Phoenix Killer” as leak claims Intel is working on a 40-core Arrow Lake CPU Notebookcheck.net
  2. Intel To Host Innovation 2023 Event on 19th September: Meteor Lake, Raptor Lake Refresh & Alchemist+ Expected Wccftech
  3. Intel 14th Gen Meteor Lake CPU Launch on 19th September Alongside Raptor Lake Desktop Refresh? Hardware Times
  4. Intel Panther Lake and Beast Lake leak suggests up to 40% more single-core performance vs Arrow Lake for former and Extra Big cores for latter Notebookcheck.net
  5. Intel Innovation 2023 set for September 19, Raptor Lake Refresh launch? VideoCardz.com
  6. View Full Coverage on Google News

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24 Zen 4 CPU Cores, 146 Billion Transistors, 128 GB HBM3, Up To 8x Faster Than MI250X

AMD has just confirmed the specs of its Instinct MI300 ‘CDNA 3’ accelerator which makes use of the Zen 4 CPU cores in a 5nm 3D chiplet package.

AMD Instinct MI300 ‘CDNA 3’ Specs: 5nm Chiplet Design, 146 Billion Transistors, 24 Zen 4 CPU Cores, 128 GB HBM3

The latest specifications that were unveiled for the AMD Instinct MI300 accelerator confirm that this exascale APU is going to be a monster of a chiplet design. The CPU will encompass several 5nm 3D chiplet packages, all combining to house an insane 146 Billion transistors. Those transistors include various core IPs, memory interfaces, interconnects, and much more. The CDNA 3 architecture is the fundamental DNA of the Instinct MI300 but the APU also comes with a total of 24 Zen 4 Data Center CPU cores & 128 GB of the next-generation HBM3 memory running in 8192-bit wide bus config that is truly mind-blowing.

During the AMD Financial Day 2022, the company confirmed that the MI300 will be a multi-chip and a multi-IP Instinct accelerator that not only features the next-gen CDNA 3 GPU cores but is also equipped with the next-generation Zen 4 CPU cores.

To enable greater than 2 exaflops of double precision processing power, the U.S. Department of Energy, Lawrence Livermore National Laboratory, and HPE have teamed up with AMD to design El Capitan, expected to be the world’s fastest supercomputer with delivery anticipated in early 2023. El Capitan will leverage next generation products that incorporate improvements from the custom processor design in Frontier.

  • Next generation AMD EPYC processors, codenamed “Genoa”, will feature the “Zen 4” processor core to support next generation memory and I/O sub systems for AI and HPC workloads
  • Next generation AMD Instinct GPUs based on new compute-optimized architecture for HPC and AI workloads will use next generation high bandwidth memory for optimum deep learning performance

This design will excel at AI and machine-learning data analysis to create models that are faster, more accurate, and capable of quantifying the uncertainty of their predictions.

via AMD

In the latest performance comparisons, AMD showcased that the Instinct Mi300 delivers a 8x boost in AI performance (TFLOPs) and a 5x AI performance per watt (TFLOPs/watt) boost over the Instinct MI250X.

AMD will be utilizing both 5nm and 6nm process nodes for its Instinct MI300 ‘CDNA 3’ APUs. The chip will be outfitted with the next generation of Infinity Cache and feature the 4th Gen Infinity architecture which enables CXL 3.0 ecosystem support. The Instinct MI300 accelerator will rock a unified memory APU architecture and new Math Formats, allowing for a 5x performance per watt uplift over CDNA 2 which is massive. AMD is also projecting over 8x the AI performance versus the CDNA 2-based Instinct MI250X accelerators. The CDNA 3 GPU’s UMAA will connect the CPU and GPU to a unified HBM memory package, eliminating redundant memory copies while delivering low TCO.

AMD’s Instinct MI300 APU accelerators are expected to be available by end of 2023 which is the same time as the deployment of the El Capitan supercomputer mentioned above.

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Some AMD Ryzen 5 7600X Desktop CPUs Comes With Dual Zen 4 CCDs

AMD’s Ryzen 7000 Desktop CPUs come in two flavors, one with a single CCD design and the higher core count variants with dual Zen 4 CCDs. However, it looks like AMD might be shipping some AM5 Ryzen 5 & Ryzen 7 chips with two CCDs.

AMD Ryzen 5 7600X CPU Spotted With Dual Zen 4 CCDs, Defective Ryzen 9 Chips or Actually Usable?

Recently, Der8auer posted a video showcasing his latest Delid Die Mate which can be used to delid the AMD Ryzen 7000 Desktop CPUs if you plan on using direct-die cooling. The overclocker used a Thermal Grizzly Direct Die Frame for this demonstration but upon delidding the Ryzen 5 7600X, an interesting discovery was made.

An AMD Ryzen 5 7600X CPU with dual Zen 4 CCDs is pictured. (Image Credits: Der8auer)

As soon as the AMD Ryzen 5 7600X CPU was delidded, Der8auer noticed that it featured two Zen 4 CCDs instead of one. The 7600X features 6 cores and 12 threads so it doesn’t need the extra CCD. All AMD Ryzen 7000 CPUs below the Ryzen 9 segment make use of a single CCD so it’s definitely a bit interesting to see a dual Zen 4 CCD implementation on the PCB.

Since the chip was already delidded, Der8auer put the chip under a thermal probe and checked to see if the other Zen 4 CCD was active or not. Three tiny copper blocks were used that say on each chiplet (two Zen 4 CCDs and a single IOD). When booted, only the IO die, & a single Zen 4 CCD was shown to be active since they started producing heat. This means that the other die is not running.

So that brings us to the question as to why there are two Zen 4 CCDs on this particular AMD Ryzen 5 7600X CPU. There could be two reasons, first and foremost, AMD may simply be using defective Ryzen 9 chips that only have one working Zen 4 CCD and labeling them as Ryzen 5 & Ryzen 7 parts. This would suggest that the other die is totally defective and not usable. But there is also a small possibility that this die could’ve been artificially locked and there might be a bypass to enable it. It is known that AMD locks several features of its chips artificially such as the Ryzen 7 5800X3D OC that would soon be overcome. But actually enabling a whole CCD won’t be as simple as it looks & even if this was a functional die, it would take someone with a lot of experience to bypass this.

Nevertheless, it is interesting to see AMD shipping dual Zen 4 CCDs on some of its Ryzen 7 and Ryzen 5 chips. There could be a lot more chips out there but unless you are delidding them (an actual risk that voids the warranty), you’ll never know what lies under the hood of your CPU.

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AMD Lowers Ryzen 7000 “Zen 4” CPU Production Plan Due To PC Market Decline, Ryzen 9 7900X Best Selling AM5 Chip

Based on an internal AMD report, we have managed to learn that the company is planning to lower its Ryzen 7000 “Zen 4” CPU production plan.

PC Market Decline & Poor Reception of AM5 Platform? AMD Plans To Lower Ryzen 7000 “Zen 4” CPU Production Plan

The report that cites AMD’s internal management suggests that the red team is planning to lower its production of the Ryzen 7000 “Zen 4” CPUs amidst a decline in the PC market and the overall poor reception of the AM5 platform. While the AM5 platform is still fresh, AMD anticipated that it would manage to attract users’ interests with a strong slew of features such as support for DDR5 and PCIe 5.0 technologies however that in return has raised the prices of the motherboards and even the entry-level B650 series that was recently introduced has failed to hit the $125 US which AMD had promised.

The report also states that enthusiasts are what’s keeping the AM5 floating at the moment and the Ryzen 9 7900X has become the top/best seller with its sales reportedly being the highest amongst the entirety of the Zen 4 lineup. The $549 US chip seems to be far more attractive than the Ryzen 7 7700X ($399 US) and the Ryzen 5 7600X ($299 US). This statistic isn’t based on retailer-specific sales but instead on global shipments and retail numbers.

The reason for this is that most entry-level buyers can just drop in and upgrade to the Ryzen 7 5800X3D on the existing AM4 platform if they want better gaming performance. For them, the 8 Zen 3 cores still offer decent multi-threading performance while the 3D V-Cache accelerators game performance beyond the 12900K. Now, there has been an increase in talks regarding a possible X3D launch simultaneously on the AM4 and AM5 platforms. AMD is already readying itself for the Ryzen 7000 3D V-Cache launch which should be announced by CES 2023 but whether AM4 gets a new X3D option remains to be seen.

Even without X3D options, the AM4 lineup has plenty of juice with discounted 6, 8, 12, 16 core chips that offer far more value than anything on the AM5 platform.

The disparity between the AM4 and AM5 sales can be seen in statistics shared by TechEpiphany:

Currently, almost all major retailers have plenty of AMD Ryzen 7000 CPUs and several AM5 boards in stock so unless there’s a huge demand for them, there’s no need to keep the production going on at full capacity. As the market gets better in 2023 and demand starts going back up, AMD may simply resume production to normal however by that time, the normal chips will have to share some of that capacity with other Zen 4 lines such as X3D and mobility parts. Not to mention the Zen 4 EPYC CPUs.

Are you planning to upgrade to AMD Ryzen 7000 & the AM5 platform?Poll Options are limited because JavaScript is disabled in your browser.



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AMD Zen 4 Ryzen 9 7950X and Ryzen 5 7600X Review: Retaking The High-End

Back at CES 2022, which was held in Las Vegas earlier at the beginning of the year, AMD announced that its new Zen 4 core would be coming sometime in the second half of 22. During AMD’s ‘together we advance_PCs’ live streamed event at the end of August, AMD unveiled its Ryzen 7000 series of desktop processors, with four SKUs aimed at different product segments. Today AMD has officially launched Ryzen 7000 with the Ryzen 9 7950X sitting as the brand’s representative of performance leadership in an x86 processor for desktops.

On paper, the AMD Ryzen 9 7950X is a 16C/32T behemoth to take overall performance leadership in desktop computing. Their entry point into the market is the Ryzen 5 7600X, which has 6C/12T and harnesses all the benefits of the flagship in a more svelte and affordable chiplet-based package. AMD pins its hopes on bringing that all-important performance crown back to its side with Zen 4 with its new architecture based on TSMC’s 5 nm process; prepare for battle. We’ve detailed what Zen 4 brings to the table regarding the new microarchitecture and tests the new Ryzen 9 7950X and Ryzen 5 7600X through our CPU suite.

New Zen 4 Core on TSMC 5nm, Boost Up to 5.7 GHz!!

The latest Ryzen 7000 series of processors are direct replacements to the Ryzen 5000 series, with a new chipset andell as a newly designed microarchitecture both on the front and back end of the silicon’s design.

As it stands at the time of writing, AMD is launching four processors based on its 5nm Zen 4 core, ranging from a 6C/12T part all the way up to 16C/32T; just like with the previous Ryzen 5000 (Zen 3) and Ryzen 3000 series (Zen 2) launches.

The Ryzen 9 7950X: 16 Cores, 32 Threads, New 170 W TDP: $699

Looking at the specifications of the four AMD Ryzen 7000 processors, the top SKU is the Ryzen 9 7950X, with sixteen Zen 4 cores (two threads per core, 32T) two eight-core core 5nm CCDs. The Ryzen 9 7950X has a base frequency of 4.5 GHz, with a turbo frequency on one core of 5.7 GHz,, which as it stands, is the fastest CPU core in the world for the desktop space today.

AMD has also given the Ryzen 9 7950X a larger 170 W TDP, which when compared to its Ryzen 5000 counterpart, the 5950X, is an increase of 65 W (170W versus 105W) This increase in overall power has allowed AMD to improve on its frequencies, as well as giving its Precision Boost Overdrive overclocking technology more room to breathe; more power typically means more performance.

The Ryzen 9 7900X, Ryzen 7 7700X, and Ryzen 5 7600X

Moving one down the stack is the Ryzen 9 7900X, which is a 12C/24T and 170W TDP part; it has a higher base frequency than the 7950X of 4.7 GHz, but with a slightly lower boost frequency of up to 5.6 GHz.  AMD has launched one Ryzen 7 part designed for mid-range desktop computing, through the Ryzen 7 7700X, which is an 8C/16T SKU, with a boost frequency on a single core of up to 5.4 GHz, with a base frequency of 4.5 GHz.

Focusing on the entry-level segment, its Ryzen 5 7600X looks to capitalize on offering 6C/12T with its previous series maximum TDP o 105W, at a reasonable price point. The Ryzen 5 7600X includes a base frequency of 4.7 GHz, with a modest (compared to Ryzen 9) boost frequency on a single core of 5.3 GHz.

AMD Ryzen 7000 versus Ryzen 5000
AnandTech Cores
Threads
Base
Freq
Turbo
Freq
Memory
Support
L3
Cache
TDP MSRP
Ryzen 9 7950X 16C / 32T 4.5GHz 5.7GHz DDR5-5200 64 MB 170 W $699
Ryzen 9 5950X 16C / 32T 3.4 GHz 4.9 GHz DDR4-3200 64 MB 105 W $799
 
Ryzen 9 7900X 12C / 24T 4.7GHz 5.6GHz DDR5-5200 64 MB 170 W $549
Ryzen 9 5900X 12 C / 24T 3.7 GHz 4.8 GHz DDR4-3200 64 MB 105 W $549
 
Ryzen 7 7700X 8C / 16T 4.5GHz 5.4GHz DDR5-5200 32 MB 105 W $399
Ryzen 7 5800X 8C / 16T 3.8 GHz 4.7 GHz DDR4-3200 32 MB 105 W $449
 
Ryzen 5 7600X 6C / 12T 4.7GHz 5.3GHz DDR5-5200 32 MB 105 W $299
Ryzen 5 5600X 6C / 12T 3.7 GHz 4.6 GHz DDR4-3200 32 MB 65 W $299

Comparing apples to apples, so to speak, from the new Zen 4 generation to the previous Zen 3 generations with like-for-like products, Ryzen 7000 has made some big overall improvements to the chips’ capabilities. Starting at the top tier, the Ryzen 9 7950X has an enormous improvement in base and boost frequencies, which makes Zen 4’s efficiency better than any previous Ryzen generation.

This has been possible in part through superior power efficiency, as the Zen 4 article is largely a Zen 3 refinement, but produced on TSMC’s 5 nm process node (from TSMC 7 nm). This efficiency has allowed AMD to boost clockspeeds without breaking the power bank, with the 105W TDP 7700X seeing a 700MHz improvement for no change in TDP. Coupled with a 13% TDP improvement, and the Ryzen 7000 series chips can deliver some significant single-threaded performance gains. And multi-threaded performance is not left out in the cold, either; by increasing their top TDP to 170W, AMD is able to keep the CPU cores on their 12C and 16C parts at higher sustained turbo clocks, delivering much better performance there as well.

Of course one of the key arguments here is that more power equals more which is true on the part of Ryzen 7000 series. Ryzen 7000’s TJ Max for its Precision Boost Overdrive technology stands at 95°C, which means that the CPU will use all of the available thermal headroom to maximize performance.

Although this can be overridden when manually overclocking, this opens up the maximum TJ Max to 115°C. It’s key to note that users will need to use more premium and aggressive cooling types to squeeze every last drop of performance from Zen 4. The fact that Ryzen 7000 runs hot is accounted for by AMD through their design choices and implementations. As such, they have opted not to bundle their own CPU coolers with the retail packages, instead directing buyers to fairly powerful third-party coolers.

New AM5 Socket: AM4 Coolers will Support AM5 Too

AMD has also transitioned to a new chipset for Ryzen 7000, named AM5. Along with AM5 also comes a new socket, the LGA1718. Now what’s interesting is AMD has specified that most AM4 socketed coolers will support the new LGA1718 socket on AM5; this is great for keeping with compatibility from the previous generation.

This also means that AM4 is now a thing of the past, although it does offer some incredible right now, as well as support with the cheaper DDR4 too. AMD has of course switched to support for DDR5 memory, with JEDEC settings across all four CPUs set at DDR5-5200; an improvement in Intel’s 12th Gen Core series support for DDR5-4800.

AMD has unveiled four new chipsets, two Extreme variants named X670E and B650E, with two regular chipsets, aptly named X670 and B650, original and simple. The top tier X670E series will feature both PCIe 5.0 lanes to the top PEG slot, with support for PCIe 5.0 storage devices which are expected in November 2022. As for its regular X670 chipset, PCIe 5.0 to the PEG slot is optional, not mandatory, like on X670E.

The B650 chipsets are designed to be more affordable and, as such only feature PCIe 4.0 lanes to the PEG slot. They do, however feature at least one PCIe 5.0 x4 storage slot. The B650E is reserved for those lower-end boards that want to include PCIe 5.0 to the graphics card, although users looking to utilize PCIe 5.0 support should opt for,X670E; better boards, better controllers, and better specifications.

New I/O Die: TSMC 6nm For Ryzen 7000

As we’ve seen previously from the Ryzen 5000 series, AMD uses chiplet packaging, with two core complex dies (CCD) on its top SKU, with an I/O die hosting all of the PCIe 5.0, the integrated memory controller (IMC), and new for Ryzen 7000, two CU’s of AMD’s rDNA 2 integrated graphics. Some key advantages of AMD’s new 6 nm TSMC I/O die means more transistors, better efficiency at the manufacturing stage, and ultimately most importantly of all, from an efficiency point of view, lower overall power draw.

It’s time to dive deep into all of AMD’s new improvements and changes for its Zen 4 microarchitecture. Over the following pages we’ll, be going over the following:

  1. Ryzen 7000 Overview: Comparing Ryzen 7000 to Ryzen 5000 specifications
  2. Socket AM5: The New Platform For Consumer AMD
  3. More I/O For AM5: PCIe 5, Additional PCIe Lanes, & More Displays
  4. AM5 Chipsets: X670 and B650, Built by ASMedia
  5. DDR5 & AMD EXPO Memory: Memory Overclocking, AMD’s Way
  6. Ryzen 7000 I/O Die: TSMC & Integrated Graphics at Last
  7. Zen 4 Architecture: Power Efficiency, Performance, & New Instructions
  8. Zen 4 Execution Pipeline: Familiar Pipes With More Caching
  9. Test Bed and Setup
  10. Core-to-Core Latency
  11. SPEC2017 Single-Threaded Results
  12. SPEC2017 Multi-Threaded Results
  13. CPU Benchmark Performance: Power, Web, & Science
  14. CPU Benchmark Performance: Simulation and Encoding
  15. CPU Benchmark Performance: Rendering
  16. CPU Benchmark Performance: Legacy Tests
  17. Gaming Performance: 720p and Lower
  18. Gaming Performance: 1080p
  19. Gaming Performance: 4K
  20. Conclusion

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Everything you need to know about Zen 4, socket AM5, and AMD’s newest chipsets

AMD

AMD’s Ryzen 7000 launch is bigger than just the processors. The processor architecture is changing, but it’s also being accompanied by changes to everything from the chipset to the physical socket that the chips plug into. The last time this many things changed at once was back in 2017, when the first-generation Ryzen chips originally launched.

So we’re publishing two Ryzen pieces today. One is a look at the actual chips’ performance and power efficiency, located here. This one will focus on all the other changes, including the ones that will be with us long after Ryzen 7000 is old news.

We’ll split this piece up into four parts that cover the four major components of the Ryzen 7000 launch: 1) the Zen 4 CPU core, 2) the on-chip I/O die that supports the CPU’s non-CPU features and handles internal connectivity, 3) the 600-series chipsets that handle most external connectivity, and 4) the physical AM5 socket that will outlive all of the other components by a few years.

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Gold-Plated Zen 4 CCDs & Octopus-Styled IHS For Wider Cooler Compatibility

Steve over at Gamers Nexus recently got the opportunity to go hands-on with a delidded AMD Ryzen 7000 Desktop CPU.

AMD Ryzen 7000 CPU Delidding Reveals Gold-Plated IHS & Zen 4 CCDs With High-Quality TIM

The CPU that was delidded is part of the Ryzen 9 family since it has two dies and we know that the two CCD configuration is only applicable to the Ryzen 9 7950X & the Ryzen 9 7900X. The chip has a total of three dies, two of which are the aforementioned AMD Zen 4 CCDs fabricated on the 5nm process node and then we have the larger die around the center which is the IOD and that is based on a 6nm process node. The AMD Ryzen 7000 CCD measures at a die size of 70mm2 compared to 83mm2 for Zen 3 and feature a total of 6.57 Billion transistors, a 58% increase over the Zen 3 CCD with 4.15 Billion transistors,

Scattered around the package are several SMD’s (capacitors/resistors) that usually sit under the package substrate if we consider Intel’s CPUs. AMD is instead featuring them on the top layer and as such, they had to design a new kind of IHS which is internally referred to as the Octopus. We’ve already seen the delidded IHS before but now we get to see a final production chip with no lid on it to cover those gold Zen 4 nuggets!

With that said, the IHS is an interesting component of the AMD Ryzen 7000 Desktop CPUs. The one picture shows the arrangement of the 8 arms which Robert Hallock ‘Director of Technical Marketing at AMD’ refers to as the ‘Octopus’. Each arm has a small application of TIM beneath it which is used to solder the IHS to the interposer. Now delidding the chip is going to be really hard since each arm is right next to the massive array of capacitors. Each Arm is also slightly raised to make room for the SMDs and users shouldn’t worry about heat getting trapped beneath.

AMD Ryzen 7000 Desktop CPU Delidded (Image Credits: GamersNexus):

Der8auer has also given a statement to Gamers Nexus regarding his upcoming delidding kit for AMD Ryzen 7000 Desktop CPUs which is in the works and he also seems to explain why the new CPUs feature gold-plated CCDs:

Regarding the gold coating, there’s the aspect that you can solder indium to gold without the need of flux. This makes the process easier and you don’t need aggressive chemicals on your CPU. Without the gold coating, it would theoretically also work to solder the silicon to copper, but it would be more difficult and you would need the flux to break the oxide layers.

Der8auer to GamersNexus

The most interesting area of the AMD Ryzen 7000 Desktop CPU IHS, besides the arms, is the gold plated IHS which is used to increase thermal dissipation off of the CPU/IO dies and directly to the IHS. The two 5nm Zen 4 CCD’s and singular 6nm IO die have liquid-metal TIM or Thermal interface material for better heat conductivity and the aforementioned gold plating does help a lot with heat dissipation. What remains to be seen is whether the capacitors will feature silicone coating or not but from the previous package shot, it kind of looks like they do.

It is also reported that the smaller surface area of the IHS means that it will be better compatible with existing coolers with round and square-shaped cold plates. Square-shaped cold plates will be the preferred choice but round ones will work just fine too. Noctua has also pointed out the TIM application method and they are suggesting users go with the single-dot pattern in the middle of the IHS for AMD AM5 CPUs.

AMD Ryzen 7000 Desktop CPU Render (With/Without IHS):

Another thing that needs to be pointed out is that each Zen 4 CCD is really close to the edge of the IHS which wasn’t necessarily the case with previous Zen CPUs. So not only delidding will be highly difficult but the center is mostly the IO die which means that cooling equipment needs to be ready for such chips. The AMD Ryzen 7000 Desktop CPUs launch in Fall 2022 on the AM5 platform. That’s a chip that can reach up to 5.85GHz with up to 230W package power so every little amount of cooling will be a must for overclockers and enthusiasts.

AMD Mainstream Desktop CPU Generations Comparison:

AMD CPU Family Codename Processor Process Processors Cores/Threads (Max) TDPs (Max) Platform Platform Chipset Memory Support PCIe Support Launch
Ryzen 1000 Summit Ridge 14nm (Zen 1) 8/16 95W AM4 300-Series DDR4-2677 Gen 3.0 2017
Ryzen 2000 Pinnacle Ridge 12nm (Zen +) 8/16 105W AM4 400-Series DDR4-2933 Gen 3.0 2018
Ryzen 3000 Matisse 7nm (Zen 2) 16/32 105W AM4 500-Series DDR4-3200 Gen 4.0 2019
Ryzen 5000 Vermeer 7nm (Zen 3) 16/32 105W AM4 500-Series DDR4-3200 Gen 4.0 2020
Ryzen 5000 3D Warhol? 7nm (Zen 3D) 8/16 105W AM4 500-Series DDR4-3200 Gen 4.0 2022
Ryzen 7000 Raphael 5nm (Zen 4) 16/32 170W AM5 600-Series DDR5-5200 Gen 5.0 2022
Ryzen 7000 3D Raphael 5nm (Zen 4) 16/32? 105-170W AM5 600-Series DDR5-5200/5600? Gen 5.0 2023
Ryzen 8000 Granite Ridge 3nm (Zen 5)? TBA TBA AM5 700-Series? DDR5-5600+ Gen 5.0 2024-2025?



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AMD Ryzen 9 7950X Flagship Zen 4 CPU Can Hit Up To 5.85 GHz Clocks

AMD’s Ryzen 9 7950X, the flagship Zen 4 CPU, is going to offer an insanely high clock speed of up to 5.85 GHz, an increase of almost 1 GHz over the Zen 3 5950X.

AMD Ryzen 9 7950X Is Going To Be a Beast At Clock Speeds, Zen 4 “Persephone” Cores Can Hit Up To 5.85 GHz Clocks

The latest details for AMD’s flagship Ryzen 9 7950X CPU come from “Venom Warlock Marvin” over at Weibo (via HXL). The user seems to have gotten his hands on a retail sample which according to him is not even the top bin but he states that the chip can achieve an absolutely phenomenal 5.85 GHz max boost clock speed. Angstronomics was the first to point this out as the “F-Max” clocks a while back which we did cover here. With PBO & XFR enabled, the chip can achieve an even faster clock speed.

AMD Ryzen 9 7950X’s alleged CPU-z screenshot. (Image Credits: HXL)

In addition to that, the leaker reports on the codenames for the AMD Ryzen 7000 CPU’s CCDs and cores. The Raphael “Ryzen 7000” CPUs will feature up to two “Durango” CCDs and each CCD gets a total of 8 “Persephone” Zen 4 cores. A block diagram shows that each CCD features a 32 MB cache (L3) pool and a GMI3 interface on each CCD connects it with the IOD (IO Die) which will be using a 6nm process node.

AMD Ryzen 7000 “Zen 4” Raphael CPU Block Diagram (Image Credits: HXL):

AMD Ryzen 9 7950X 16 Core “Zen 4” Desktop CPU

Starting with the flagship of them all, we have the AMD Ryzen 9 7950X which retains its healthy 16 core and 32 thread count from the previous two generations. The CPU will feature an impressive base frequency of 4.5 GHz and a boost clock of up to 5.7 GHz which should make it 200 MHz faster than Intel’s Alder Lake Core i9-12900KS which has a boost frequency of 5.5 GHz on a single-core.

It looks like AMD is extracting every ounce of Hertz that it could within that 170W TDP (230W PPT) for the Ryzen 9 chips. As for the cache, the CPU comes with 80 MB of that which includes 64 MB from L3 (32 MB per CCD) and 16 MB from L2 (1 MB per core).

The AMD Ryzen 7 7700X “Zen 4” CPU will launch alongside the rest of the lineup next month. AMD also plans to do a full unveiling tomorrow.

AMD Ryzen 7000 ‘Raphael’ Desktop CPU Specs:

CPU Name Architecture Process Node Cores / Threads Base Clock Boost Clock (SC Max) Cache TDP Prices (TBD)
AMD Ryzen 9 7950X Zen 4 5nm 16/32 4.5 GHz 5.7 GHz 80 MB (64+16) 170W >$799 US
AMD Ryzen 9 7900X Zen 4 5nm 12/24 4.7 GHz 5.6 GHz 76 MB (64+12) 170W >$599 US
AMD Ryzen 7 7800X Zen 4 5nm 8/16 TBD TBD TBD TBD >$449 US
AMD Ryzen 7 7700X Zen 4 5nm 8/16 4.5 GHz 5.4 GHz 40 MB (32+8) 105W ~$299 US
AMD Ryzen 5 7600X Zen 4 5nm 6/12 4.7 GHz 5.3 GHz 38 MB (32+6) 105W >$229 US



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