Tag Archives: X670

Technology

MSI Confirms AMD Ryzen 7000 CPUs & X670 Motherboards Launch On 15th September

Leave a comment

MSI has confirmed what we exclusively said a few days ago, that AMD’s Ryzen 7000 “Zen 4” CPUs & X670 motherboards will launch on the 15th of September.

MSI Officially Confirms A 15th September Launch Date For AMD Ryzen 7000 CPUs & X670 Motherboards

You would think that AMD would beat MSI to reveal the release date of their product, but instead, the latter revealed the launch of the Ryzen 7000 CPU series and its X670 motherboard series at once, falling mid-September, and both indicating the same day.

  • Product announcement: August 29, 2022 at 8:00PM ET / August 30, 2022 at 2:00AM CET / 8:00AM TW
  • Press embargo: September 13, 2022 at 9AM ET / 3PM CET / 9PM TW
  • Sales embargo: September 15, 2022 at 9AM ET / 3PM CET / 9PM TW

AMD has not officially revealed the dates themselves but our sources already pointed this out and we even got to know about the 29th August announcement where the red team will disclose full specs and prices. We already gave you the full run-down of the specs too which we also revealed first, exclusively.

MSI plans to release four X670 motherboards initially for the AMD Ryzen 7000 Desktop CPU family which would include the MEG X670E GODLIKE, MEG X670E Ace, MPG X670E Carbon WiFI & the PRO X670E-P WIFI. We will be getting more information such as prices, overclocking, and memory DDR5 support closer to the launch. The company will also have a range of B650 chipset motherboards to showcase but they aren’t planned for launch until a bit slightly later.

Yesterday at the AMD “Meet The Experts” Livestream, MSI gave a bit more insight into their X670E motherboards. MSI is pushing things to the limits with high-end heatsink designs such as screwless M.2 Shield Frozr technology, M.2 XPANDER-Z Gen 5 Dual AIC (supporting up to two PCIe Gen 5.0 x4) SSDs in actively cooled solution), 60W USB Type-C power delivery and more robust power delivery for each tier of the motherboard. We also get a better look at the MEG X670E GODLIKE which looks as beast as ever with its massively saturated PCB design and tons of IO to work with. More details on MSI’s lineup here.

AMD AM4/TR4 Chipset Features and Specifications:

Wccftech X670E/X670 X570 X399 Refresh X399 X470 X370 B450 B350 A320 X300 A300
CrossfireX/SLI Triple CFX/2-Way SLI Triple CFX/2-Way SLI Quad SLI/CFX
(Max 6 GPU Support)		 Quad SLI/CFX
(Max 6 GPU Support)		 Triple CFX/2-Way SLI Triple CFX/2-Way SLI N/A N/A N/A N/A N/A
PCIe Gen 5 Lanes 24 (with Ryzen 7000 CPUs & above) N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A
PCIe Gen 3/4 Lanes TBD 30 +16 (with Ryzen 7 CPU) 60 (With Threadripper CPU)
4 Lanes Reserved for PCH		 60 (With Threadripper CPU)
4 Lanes Reserved for PCH		 16 (with Ryzen 7 CPU) 16 (with Ryzen 7 CPU)
8 (with Bristol Ridge)		 16 (with Ryzen 7 CPU) 16 (with Ryzen 7 CPU)
8 (with Bristol Ridge)		 16 (with Ryzen 7 CPU)
8 (with Bristol Ridge)		 16 (with Ryzen 7 CPU)
8 (with Bristol Ridge)		 16 (with Ryzen 7 CPU)
8 (with Bristol Ridge)
PCIe Gen 2 Lanes N/A N/A 8 PCIe Lanes (reserved) 8 PCIe Lanes (reserved) 8 (plus x2 PCIe Gen3 when no x4 NVMe) 8 (plus x2 PCIe Gen3 when no x4 NVMe) 6 (plus x2 PCIe Gen3 when no x4 NVMe) 6 (plus x2 PCIe Gen3 when no x4 NVMe) 4 (plus x2 PCIe Gen3 when no x4 NVMe) 4 (plus x2 PCIe Gen3 when no x4 NVMe) 4 (plus x2 PCIe Gen3 when no x4 NVMe)
USB 3.1/3,2 Gen2 TBD 8 2 2 2 2 2 2 1 0 0
USB 3.1/3.2 Gen1 TBD 12 (PCH + CPU) 13 (PCH+CPU) 13 (PCH+CPU) 10 10 6 6 6 4 4
USB 2.0 TBD N/A 6 6 6 6 6 6 6 0 0
SATA 6Gb/s 8 8 8 8 6 6 4 4 4 2 2
SATA Express TBD 2 2 2 2 2 2 2 2 1 1
DDR5 DIMMs 4 N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A
DDR4 DIMMs N/A 4 8 8 4 4 4 4 2 2 2
Overclocking
Support		 Yes Yes Yes Yes Yes Yes Yes Yes No Yes No
XFR2 Enhanced Yes Yes Yes No Yes No Yes No No No No
Precision Boost Overdrive Yes Yes Yes No Yes No Yes No No No No
NVMe Yes (Gen 5.0) Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes
Form Factor ATX ATX, MATX ATX, MATX ATX, MATX ATX, MITX ATX ATX, M-ATX ATX, M-ATX M-ATX, Mini-ITX Mini-ITX M-ATX, Mini-ITX

News Sources: VideoCardz, MSI (Weibo) , Momomo_US



Read original article here

Technology

MSI shows off AMD X670 motherboard dual-chipset design

Leave a comment

Two chipsets yet no active cooling

MSI tries to share as much information on AMD AM5 platform as possible.

The company already confirmed AMD EXPO technology for DDR5 memory overclocking profiles, as well as published an installation guide AMD Ryzen 7000 engineering sample CPU. AMD was clearly not happy about MSI being so direct with all this information, after all Computex was only a showcase, not a full reveal. Thus, some of this information was already removed on AMD request.

But MSI is clearly not bothered. During their MSI Insider stream, the company showcased the AMD X670 chipset design without the heatspreaders. This is actually the first time we get to see the dual chipset design, that AMD confirmed but did not show by themselves.

AMD X670 motherboard, Source: MSI

The AMD AM5 platform featuring LGA1718 socket will host CPUs with up to 170W PPT (socket power). The first generation AM5 CPUs will be based on Zen4 architecture with support for DDR5 memory as well as PCIe Gen5 devices. The X670E and X670 chipsets with their dual chipset design will offer up to 24 PCIe Gen5 lanes for graphics and storage.

Although it was already confirmed by AMD, the new X670 chipsets do not require active cooling. This will greatly simply the design of AMD 600 series motherboards, lower the development cost and probably also means lower power requirement.

AMD X670 chipset cooling, Source: MSI

Computex Ryzen 7000 and X670 showcase is just a glimpse of what will be released this fall (officially). AMD promised to provide more details this summer. The B650 motherboards are to feature a single-chipset design, so that should mean even smaller heatsinks.

Source:

The following video is timestamped

[MSI Gaming] Inside Computex 2022 (3,762 views)



Read original article here

Technology

AMD reveals its X670 Extreme, X670 and B650 chipsets for first-gen AM5 motherboards

Leave a comment

AMD 600-series chipsets feature PCIe Gen5, DDR5 support

AMD X670E is the flagship chipset for the new motherboard series.

AMD AM5 infrastructure is based on a new LGA 1718 socket which will natively support CPUs up to 170W. The 600-series platform is equipped for DDR5 memory and PCIe Gen5 for storage and graphics (depending on a chipset).

AMD confirmed that X670E (Extreme) is designed for “Unparalleled Capability and Extreme Overclocking”. It is designed to offer PCIe Gen5 ‘everywhere’. On the other hand we have X670 for “Enthusiasts Overclocking” with Gen5 storage support and optionally graphics. The mainstream platform based on B650 chipset will support PCIe Gen5 for storage only.

AMD 600-series chipsets, Source: VideoCardz

The 600-series motherboards will offer up to 24 PCIe Gen5 lanes for storage and graphics, up to 14 SuperSpeed USB 20 Gbps (TypeC), WiFI-E6 support with DBS/Bluetooth Low Energy 5.2. Interestingly. AMD also revealed 600-series motherboards will be equipped with up to four HDMI 2.1 and DisplayPort 2 outputs. This will come in handy considering desktop Ryzen 7000 series codenamed “Raphael” feature integrated RDNA2 graphics.

AMD SmartAccess Storage

AMD also confirms its new AM5 platform supports a new technology called SmartAccess Storage. We have revealed those plans a few weeks ago, and we were right in our predictions. This technology adds AMD platform technology and GPU decompression for Microsoft DirectStorage Enabled Games.



Read original article here