- Federal payroll processor: Oct. 11 is deadline to avert feds’ getting incomplete paychecks GovExec.com
- Federal shutdown threat prompts Navy Federal and other credit unions to offer interest-free loans – Washington Business Journal The Business Journals
- USAA offers help to those affected by potential government shutdown; also watch out for scammers WTVD-TV
- Help available for DAF Airmen, Guardians, civilians in event of lapse in appropriations Air Force Link
- Navy Federal to offer paycheck relief to members impacted by government shutdown CBS News 8
- View Full Coverage on Google News
Tag Archives: processor
Samsung Galaxy S24 could use special Snapdragon processor
For the first time in history, Samsung will use a Qualcomm Snapdragon chipset in all its Galaxy S series smartphones (Galaxy S23) sold worldwide. And this change comes after years of disappointments with its in-house Exynos processors. However, Samsung isn’t using the same Snapdragon chip everyone else uses. The South Korean firm will use a higher-clocked version of the Snapdragon 8 Gen 2 in the Galaxy S23, and this won’t be the last time it does that.
It is rumored that Samsung will continue to use special versions of Snapdragon chipsets in its high-end smartphones in the future. The chipset inside the Galaxy S23 is reportedly called ‘Snapdragon 8 Gen 2 Mobile Platform For Galaxy,’ and the company will also use the Snapdragon For Galaxy series chipset in the Galaxy S24 series. Tipster Yogesh Brar claims that Samsung will continue to use Snapdragon For Galaxy processors until Samsung’s in-house chipsets are good enough to be as good as their Snapdragon counterparts.
If you don’t know already, Samsung’s Exynos chipsets (designed by Samsung’s System LSI division) haven’t been good enough over the past few years. They have always performed poorer than competing Snapdragon chipsets and had issues under sustained workloads and cellular performance, resulting in poorer battery life. So, Samsung’s smartphone division (Samsung MX) created its own team of engineers to design processors tailor-made for high-end Galaxy smartphones. The first chip from the new unit will reportedly debut with the Galaxy S25 in 2025.
Until that chipset is ready, the South Korean firm might use higher-clocked versions of flagship Snapdragon chips from Qualcomm. This could mean Galaxy buyers won’t complain about their smartphones’ performance and battery life. And when Samsung finally brings back its in-house chipset, it should be better than the competing Snapdragon processor to justify its existence. Qualcomm will then move over to other Android OEMs once its deal with Samsung ends.
If you are excited about the Snapdragon 8 Gen 2-equipped Galaxy S23, you can pre-reserve it today and get up to $100 Samsung Store credit. The company will announce additional pre-order benefits after the Galaxy S23’s launch event.
Wrinkle-free Samsung Galaxy Z Fold5 to come with 108 MP main camera and to reach greater heights than the Galaxy Z Fold4
So, the 5th generation of the Galaxy Z Fold reaches new physical heights over the predecessor in folded/unfolded states, and it is a little wider when folded. The source also reveals that the unfolded screen of the Galaxy Z Fold5 will not have wrinkles, which should please those who find the crease in the Samsung Galaxy Z Fold4 too egregious for their liking.
As for the camera equipment, the Samsung Galaxy Z Fold5 will allegedly sport a 108 MP main camera (f/1.7, OIS, dual-pixel PDAF) that is supported by a 64 MP telephoto unit with 2x optical zoom and a 12 MP ultra-wide lens. In addition, the 7.6-inch Galaxy Z Fold5 is expected to offer a 1768 x 2208 resolution and come with Gorilla Glass Victus. It’s opined that the mysterious “Snapdragon 985” processor may be renamed by the time the latest premium foldable smartphone from Samsung hits the shelves.
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AMD Revealed 31 Vulnerabilities Within Its Processor Lines, Ryzen & EPYC CPUs Included
AMD revealed in the most recent January update that thirty-one new vulnerabilities were found in its processors, covering Ryzen and EPYC CPUs.
AMD hit with 31 new vulnerabilities to start 2023, affecting Ryzen & EPYC CPU lines
The company has created numerous mitigations to alleviate the exposed processors and has also disclosed a report from the company in cooperation with teams from three top companies — Apple, Google, and Oracle. The company also announced several AGESA variants listed in the update (AGESA code is found when building the system’s BIOS and UEFI code).
Due to the vulnerability’s nature, the AGESA changes have been delivered to OEMs, and any patching will depend on each vendor to release it as soon as possible. It would be wise for consumers to visit the vendor’s official website to find out if there is a new update waiting for download rather than waiting for the company to roll it out later.
AMD Processors vulnerable to this new attack include Ryzen models for desktops, HEDT, Pro, and mobile CPU series. There is a single vulnerability labeled as “high severity,” while two others are less extreme but still important to patch. All exposures are attacked through the BIOS and ASP bootloader (also known as the AMD Secure Processor bootloader).
AMD CPU series that are vulnerable are:
- Ryzen 2000 (Pinnacle Ridge) series processors
- Ryzen 2000 APUs
- Ryzen 5000 APUs
- AMD Threadripper 2000 HEDT and Pro server processor series
- AMD Threadripper 3000 HEDT and Pro server processor series
- Ryzen 2000 series mobile processors
- Ryzen 3000 series mobile processors
- Ryzen 5000 series mobile processors
- Ryzen 6000 series mobile processors
- Athlon 3000 series mobile processors
Twenty-eight AMD vulnerabilities have been discovered affecting EPYC processors, with four models labeled with a “high severity” by the company. The three of high severity can have arbitrary code that can be executed through attack vectors in numerous areas. Also, one of the three listed has an additional exploit that permits writing data to specific sections leading to data loss. Other research teams found another fifteen vulnerabilities with lower severity and nine with minor severity.
Because of the large number of affected processors exploited, the company chose to disclose this recent vulnerability list that would typically be published in May and November each year and make sure that mitigations were prepared for release. Other vulnerabilities within AMD products include a variant of Hertzbleed, another that acts similarly to the Meltdown exploit, and one called “Take A Way.”
| CVE | Severity | CVE Description |
| CVE‑2021‑26316 | High | Failure to validate the communication buffer and communication service in the BIOS may allow an attacker to tamper with the buffer resulting in potential SMM (System Management Mode) arbitrary code execution. |
| CVE‑2021‑26346 | Medium | Failure to validate the integer operand in ASP (AMD Secure Processor) bootloader may allow an attacker to introduce an integer overflow in the L2 directory table in SPI flash resulting in a potential denial of service. |
| CVE‑2021‑46795 | Low | A TOCTOU (time-of-check to time-of-use) vulnerability exists where an attacker may use a compromised BIOS to cause the TEE OS to read memory out of bounds that could potentially result in a denial of service. |
DESKTOP
| CVE | AMD Ryzen™ 2000 series Desktop Processors “Raven Ridge” AM4 |
AMD Ryzen™ 2000 Series Desktop Processors “Pinnacle Ridge” |
AMD Ryzen™ 3000 Series Desktop Processors “Matisse” AM4 |
AMD Ryzen™ 5000 Series Desktop Processors “Vermeer” AM4 |
AMD Ryzen™ 5000 Series Desktop Processor with Radeon™ Graphics “Cezanne” AM4 |
| Minimum version to mitigate all listed CVEs | Raven-FP5-AM4 1.1.0.D ComboAM4PI 1.0.0.8 ComboAM4v2 PI 1.2.0.4 PinnaclePI-AM4 1.0.0.C |
PinnaclePI-AM4 1.0.0.C ComboAM4PI 1.0.0.8 ComboAM4v2 PI 1.2.0.4 |
N/A | N/A | ComboAM4v2 PI 1.2.0.8 |
| CVE‑2021‑26316 | Raven-FP5-AM4 1.1.0.D ComboAM4PI 1.0.0.8 ComboAM4v2 PI 1.2.0.4 PinnaclePI-AM4 1.0.0.C |
PinnaclePI-AM4 1.0.0.C ComboAM4PI 1.0.0.8 ComboAM4v2 PI 1.2.0.4 |
N/A | N/A | ComboAM4v2 PI 1.2.0.4 |
| CVE‑2021‑26346 | N/A | N/A | N/A | N/A | ComboAM4v2 PI 1.2.0.8 |
| CVE‑2021‑46795 | N/A | N/A | N/A | N/A | ComboAM4v2 PI 1.2.0.5 |
HIGH END DESKTOP
| CVE | 2nd Gen AMD Ryzen™ Threadripper™ Processors “Colfax” |
3rd Gen AMD Ryzen™ Threadripper™ Processors “Castle Peak” HEDT |
| Minimum version to mitigate all listed CVEs | SummitPI-SP3r2 1.1.0.5 | CastlePeakPI-SP3r3 1.0.0.6 |
| CVE‑2021‑26316 | SummitPI-SP3r2 1.1.0.5 | CastlePeakPI-SP3r3 1.0.0.6 |
| CVE‑2021‑26346 | N/A | N/A |
| CVE‑2021‑46795 | N/A | N/A |
WORKSTATION
| CVE | AMD Ryzen™ Threadripper™ PRO Processors “Castle Peak” WS |
AMD Ryzen™ Threadripper™ PRO Processors “Chagall” WS |
| Minimum version to mitigate all listed CVEs | CastlePeakWSPI-sWRX8 1.0.0.7 ChagallWSPI-sWRX8 0.0.9.0 |
N/A |
| CVE‑2021‑26316 | CastlePeakWSPI-sWRX8 1.0.0.7 ChagallWSPI-sWRX8 0.0.9.0 |
N/A |
| CVE‑2021‑26346 | N/A | N/A |
| CVE‑2021‑46795 | N/A | N/A |
MOBILE – AMD Athlon Series
| CVE | AMD Athlon™ 3000 Series Mobile Processors with Radeon™ Graphics “Dali”/”Dali” ULP |
AMD Athlon™ 3000 Series Mobile Processors with Radeon™ Graphics “Pollock” |
| Minimum version to mitigate all listed CVEs | PicassoPI-FP5 1.0.0.D | PollockPI-FT5 1.0.0.3 |
| CVE‑2021‑26316 | PicassoPI-FP5 1.0.0.D | PollockPI-FT5 1.0.0.3 |
| CVE‑2021‑26346 | N/A | N/A |
| CVE‑2021‑46795 | N/A | N/A |
MOBILE – AMD Ryzen Series
| CVE | AMD Ryzen™ 2000 Series Mobile Processors “Raven Ridge” FP5 |
AMD Ryzen™ 3000 Series Mobile processor, 2nd Gen AMD Ryzen™ Mobile Processors with Radeon™ Graphics “Picasso” |
AMD Ryzen™ 3000 Series Mobile Processors with Radeon™ Graphics “Renoir” FP6 |
AMD Ryzen™ 5000 Series Mobile Processors with Radeon™ Graphics “Lucienne” |
AMD Ryzen™ 5000 Series Mobile Processors with Radeon™ Graphics “Cezanne” |
AMD Ryzen™ 6000 Series Mobile Processors “Rembrandt” |
| Minimum version to mitigate all listed CVEs | N/A | PicassoPI-FP5 1.0.0.D ComboAM4PI 1.0.0.8 ComboAM4v2 PI 1.2.0.4 | RenoirPI-FP6 1.0.0.9 ComboAM4v2 PI 1.2.0.8 |
CezannePI-FP6 1.0.0.B | CezannePI-FP6 1.0.0.B | N/A |
| CVE‑2021‑26316 | N/A | PicassoPI-FP5 1.0.0.D ComboAM4PI 1.0.0.8 ComboAM4v2 PI 1.2.0.4 | RenoirPI-FP6 1.0.0.7 ComboAM4v2 PI 1.2.0.4 | CezannePI-FP6 1.0.0.6 | CezannePI-FP6 1.0.0.6 | N/A |
| CVE‑2021‑26346 | N/A | N/A | RenoirPI-FP6 1.0.0.9 ComboAM4v2 PI 1.2.0.8 |
CezannePI-FP6 1.0.0.B | CezannePI-FP6 1.0.0.B | N/A |
| CVE‑2021‑46795 | N/A | N/A | RenoirPI-FP6 1.0.0.7 ComboAM4v2 PI 1.2.0.5 | CezannePI-FP6 1.0.0.6 | CezannePI-FP6 1.0.0.6 | N/A |
News Sources: Tom’s Hardware, AMD Client Vulnerabilities – January 2023, AMD Server Vulnerabilities – January 2023
Sort of PS5 Slim: No hardware upgrades and no disc drive compatibility with PlayStation 5 Digital Edition for the modular PS5 “Gen 2” console
There might be some considerable criticism heading Sony’s way soon if new details about the so-called modular PS5 shared by Insider Gaming’s Tom Henderson are true. The source has frequently discussed upgrades and changes to the PlayStation 5, and he revealed that there was work ongoing with a console that would have a detachable disk drive, which will eventually replace the current PlayStation 5 and PlayStation 5 Digital Edition devices. This “PS5 Gen 2” would have a slimmer profile thanks to its modular nature, so it could even end up being the widely expected PS5 Slim.
While official word about a PS5 Slim would undoubtedly excite the community, Henderson’s latest tweet about PlayStation matters will likely not. Firstly, he states, “doesn’t seem like there are any major hardware changes from the original console”. So, this apparent PS5 v2 device will clearly not be any kind of PS5 Pro machine, and it won’t be the frequently rumored console coming with an improved custom SoC from AMD inside it. A sort of PlayStation 5 Slim console may be the best fans can hope for in regard to something new turning up in 2023.
However, Henderson rubs salt into the wound with the second part of his post, claiming, “disc drive likely won’t be compatible with the current digital version”. So, all those PlayStation 5 Digital Edition owners out there, and there are millions of them, may feel a pang of disappointment and even disapproval that this modular next-generation PS5 will be incapable of sharing its detachable disc drive with them. Some commenters have even called this potential situation a kind of money grab from Sony.
According to the source, production of this PlayStation 5 revision will start in April, and it could be available to buy in September. This means there will be a lot more leaks about the device to come yet, and it seems likely that Sony will make sure a PS5 Gen 2 will have plenty of selling points. If this rumored 2023 variant actually does end up being the PS5 Slim, there will still be many flocking to buy a slimmed-down and lighter PlayStation 5 console, regardless of it having a detachable and backwards incompatible disc drive.
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My interest in technology began after I was presented with an Atari 800XL home computer in the mid-1980s. I especially enjoy writing about technological advances, compelling rumors, and intriguing tech-related leaks. I have a degree in International Relations and Strategic Studies and count my family, reading, writing, and travel as the main passions of my life. I have been with Notebookcheck since 2012.
New Samsung Galaxy S23, Galaxy S23+, and Galaxy S23 Ultra storage size leak leads to 128 GB resurrection and three different leakers in disagreement
The latest Samsung Galaxy S23 RAM and storage leak has come courtesy of SnoopyTech, who has built up a decent reputation for offering up accurate tech-related information. The leaker uses the codenames “DM1”, “DM2”, and “DM3” for the devices, with “Project Diamond” being the internal codename for the Samsung Galaxy S23 series. According to the tipster, the Galaxy S23 series will come in the following configurations:
- DM1 – Samsung Galaxy S23: 8 GB + 128 GB, 8 GB + 256 GB
- DM2 – Samsung Galaxy S23 Plus: 8 GB + 256 GB, 8 GB + 512 GB
- DM3 – Samsung Galaxy S23 Ultra: 8 GB + 256 GB, 12 GB + 512 GB, and probably a 12 GB + 1 TB model available via the Samsung store
While using the codenames may offer an added hint of credibility to the leak, the source has avoided using a term such as “confirmed” or “official”. But this did not stop Ahmed Qwaider, who previously posted a memory + storage configuration-related leak along with the qualifier “officially”. Qwaider claimed that there would be no 128 GB of storage to be seen anywhere, and while neither the Galaxy S23+ nor Galaxy S23 Ultra are stuck with 128 GB in the above leak, it is clear to see that the Galaxy S23 is.
To confuse matters a little more, yet another leaker, TheGalox_, has thrown another spanner in the works by stating that both the regular Galaxy S23 and Galaxy S23+ would be treated with up to 512 GB of storage space. It appears the three tipsters simply cannot agree on what Samsung has planned with the base model in the upcoming Galaxy S23 series:
- SnoopyTech – 128 GB option but no 512 GB option (S23)
- Qwaider – no 128 GB option and with no 512 GB option specifically mentioned (S23/S23+)
- TheGalox – up to 512 GB option (S23/S23+)
The newest leak, from SnoopyTech, is certainly believable, as it would allow Samsung to launch the Galaxy S23 series with an “affordable” SKU in the lineup. Meanwhile, the 128 GB option is eliminated from the Galaxy S23+ and Galaxy S23 Ultra model choices, while the former gets a better higher option of a 512 GB variant, thus also demonstrating how Samsung has upgraded the 2023 flagship smartphones over the previous year’s offering.
Buy an unlocked and renewed Samsung Galaxy S20+ on Amazon
My interest in technology began after I was presented with an Atari 800XL home computer in the mid-1980s. I especially enjoy writing about technological advances, compelling rumors, and intriguing tech-related leaks. I have a degree in International Relations and Strategic Studies and count my family, reading, writing, and travel as the main passions of my life. I have been with Notebookcheck since 2012.
Samsung Galaxy S23, Galaxy S23+, and Galaxy S23 Ultra to come with 256 GB minimum storage option
All three of the phones in the Samsung Galaxy S23 series will come with a minimum of 256 GB storage, according to a new leak. The lineup, which features the Galaxy S23, Galaxy S23+, and Galaxy S23 Ultra, is expected to be launched in February. The Samsung Galaxy S23 Ultra will apparently feature a 1 TB variant.
Sometimes it is the small changes between smartphone generations that please fans the most, and it is likely this new leak from Ahmed Qwaider will make many future Samsung Galaxy S23 owners happy. It seems the South Korean manufacturer has decided to boost the minimum amount of storage available in its flagship smartphones from the 128 GB option of the Galaxy S22 series to a 256 GB option for the Galaxy S23 series.
Qwaider breaks down the storage options for each device in the Galaxy S23 range, and the standard Galaxy S23 and the Galaxy S23+ are mentioned with only one variant each at the moment: 8 GB + 256 GB. It seems there will be three choices for the Samsung Galaxy S23 Ultra, with 256 GB, 512 GB, and 1 TB being the options for the premium device in the lineup. However, the leaker only mentions 12 GB of RAM for the S23 Ultra when there have already been multiple reports of an 8 GB variant.
It’s possible Qwaider is simply breaking down the currently confirmed storage choices for the Galaxy S23 series rather than listing every single variant that Samsung will produce. Offering a 2023 flagship smartphone with just 128 GB storage would not have been a smart business move by Samsung, so the boost to a minimum of 256 GB storage is just one of likely many small but important changes that will be coming to the Galaxy S23 smartphones.
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⭕️Exclusively & officially????
Good news for Samsung fans
It’s amazing to beGalaxy S23 8Ram + 256G????
Galaxy S23+ 8Ram +256G????
Galaxy S23 Ultra 12R+256G+512G+1TGoodbye 128G
I’ve been waiting for this move for a long time
A very good move from Samsung thanks @technizoconcept pic.twitter.com/7EZbA6tyjK— Ahmed Qwaider (@AhmedQwaider888) January 1, 2023
My interest in technology began after I was presented with an Atari 800XL home computer in the mid-1980s. I especially enjoy writing about technological advances, compelling rumors, and intriguing tech-related leaks. I have a degree in International Relations and Strategic Studies and count my family, reading, writing, and travel as the main passions of my life. I have been with Notebookcheck since 2012.
Tensor G2 confirmed as 5nm processor, not 4nm as expected
According to new information, the Tensor G2 is, in fact, built upon a 5nm manufacturing process and not 4nm as was expected ahead of launch.
This means that the Pixel 7 series processor is not utilizing a 4nm processor. Some confusion seems to have arisen from pre-release benchmarks and the fact that Google did not initially confirm the process used for Tensor G2. During the keynote for the Pixel 7 series, there were claims of 60% speed and 20% efficiency gains over the previous generation.
A deep dive into leaked Geekbench listings before launch has been slightly misinterpreted with some legitimate elements such as clock speed and core layout somewhat tarnished by incorrect die size being predicted. No evidence seemingly lies within the Pixel 7 builds, which lends more credence to the theory that a 5nm process is being used. Since then, a Google spokesperson has confirmed to Android Authority that Tensor G2 is, in fact, built using a 5nm process:
We purpose-built Google Tensor G2 for real-world use cases. Our final architecture, which includes 5nm, helped us reach that goal while increasing both performance and power efficiency. This approach also allowed us to add new capabilities while taking a step forward on machine learning with our next generation TPU with G2.
As AA notes, this still isn’t a fully comprehensive answer to the question though as Google hasn’t given the specific manufacturing process used. This does mean that on paper the 5nm Tensor G2 isn’t as efficient as last year’s 4nm-based Qualcomm Snapdragon 8 Gen 1 or even Samsung’s own Exynos 2200. This might come as a disappointment, but Tensor G2 comes with very minor clock speed boosts over its predecessor. Google is banking on better machine-learning power with a next-gen TPU.
Whether or not the Tensor G2 in Pixel 7 uses a 5nm manufacturing process rather than 4nm matters to you is a bigger question. If the Pixel 7 series runs how you expect with prowess in areas that other devices do not, such as image and language processing, does or would that make it a no-go? Let us know down in the comments section below.
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Galaxy S23 Ultra: Samsung confirms 200 MP camera and brings in Qualcomm 3D Sonic Max as further rumors hint at paradigm-shifting smartphone
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2022 HP Spectre x360 13.5 review: The pinnacle subnotebook convertible
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