- NVIDIA GH200 Grace-Hopper Superchip With 72 Core ARM CPU Tested, Comes Close To AMD EPYC Genoa & Intel Emerald Rapids Wccftech
- Nvidia’s “Grace” Arm CPU Holds Its Own Against X86 For HPC The Next Platform
- Nvidia Grace Superchip loses to Intel Sapphire Rapids in HPC performance benchmarks, but promises greater efficiency Tom’s Hardware
- Exclusive: Nvidia’s fastest AI chip ever is finally available for preorder — and you can get the GH200 for as little as $4.99 per hour TechRadar
- Nvidia Grace CPU Loses to Intel Sapphire Rapids in First HPC Benchmarks ExtremeTech
Tag Archives: EPYC
Microsoft Azure Is The First Cloud Service To Feature AMD Instinct MI300X, 4th Gen EPYC VMs In Q1 2024 – Wccftech
- Microsoft Azure Is The First Cloud Service To Feature AMD Instinct MI300X, 4th Gen EPYC VMs In Q1 2024 Wccftech
- An EPYC Miss? Microsoft Azure Instances Pair AMD’s MI300X With Intel’s Sapphire Rapids Tom’s Hardware
- AMD Announces AMD Instinct MI300 Accelerator Launch Event Highlighting Rapidly Expanding Ecosystem of AI Customers and Partners Yahoo Finance
- AMD to Bring its Best AI Compute on Microsoft, with AI PCs Analytics India Magazine
- AMD announces new generative AI capabilities for Microsoft customers at Ignite developers conference The Hindu
- View Full Coverage on Google News
AMD Expands Leadership Data Center Portfolio with New EPYC CPUs and Shares Details on Next-Generation AMD Instinct Accelerator and Software Enablement for Generative AI – Yahoo Finance
- AMD Expands Leadership Data Center Portfolio with New EPYC CPUs and Shares Details on Next-Generation AMD Instinct Accelerator and Software Enablement for Generative AI Yahoo Finance
- AMD reveals new A.I. chip to challenge Nvidia’s dominance CNBC
- AMD Data Center and AI Technology Premiere Live Blog: Instinct MI300, 128-Core EPYC Bergamo Tom’s Hardware
- With no big customers named, AMD’s AI chip challenge to Nvidia remains uphill fight Yahoo Finance
- AMD’s AI Tech Premiere: Everything That Was Announced – Advanced Micro Devices (NASDAQ:AMD) Benzinga
- View Full Coverage on Google News
AMD Revealed 31 Vulnerabilities Within Its Processor Lines, Ryzen & EPYC CPUs Included
AMD revealed in the most recent January update that thirty-one new vulnerabilities were found in its processors, covering Ryzen and EPYC CPUs.
AMD hit with 31 new vulnerabilities to start 2023, affecting Ryzen & EPYC CPU lines
The company has created numerous mitigations to alleviate the exposed processors and has also disclosed a report from the company in cooperation with teams from three top companies — Apple, Google, and Oracle. The company also announced several AGESA variants listed in the update (AGESA code is found when building the system’s BIOS and UEFI code).
Due to the vulnerability’s nature, the AGESA changes have been delivered to OEMs, and any patching will depend on each vendor to release it as soon as possible. It would be wise for consumers to visit the vendor’s official website to find out if there is a new update waiting for download rather than waiting for the company to roll it out later.
AMD Processors vulnerable to this new attack include Ryzen models for desktops, HEDT, Pro, and mobile CPU series. There is a single vulnerability labeled as “high severity,” while two others are less extreme but still important to patch. All exposures are attacked through the BIOS and ASP bootloader (also known as the AMD Secure Processor bootloader).
AMD CPU series that are vulnerable are:
- Ryzen 2000 (Pinnacle Ridge) series processors
- Ryzen 2000 APUs
- Ryzen 5000 APUs
- AMD Threadripper 2000 HEDT and Pro server processor series
- AMD Threadripper 3000 HEDT and Pro server processor series
- Ryzen 2000 series mobile processors
- Ryzen 3000 series mobile processors
- Ryzen 5000 series mobile processors
- Ryzen 6000 series mobile processors
- Athlon 3000 series mobile processors
Twenty-eight AMD vulnerabilities have been discovered affecting EPYC processors, with four models labeled with a “high severity” by the company. The three of high severity can have arbitrary code that can be executed through attack vectors in numerous areas. Also, one of the three listed has an additional exploit that permits writing data to specific sections leading to data loss. Other research teams found another fifteen vulnerabilities with lower severity and nine with minor severity.
Because of the large number of affected processors exploited, the company chose to disclose this recent vulnerability list that would typically be published in May and November each year and make sure that mitigations were prepared for release. Other vulnerabilities within AMD products include a variant of Hertzbleed, another that acts similarly to the Meltdown exploit, and one called “Take A Way.”
CVE | Severity | CVE Description |
CVE‑2021‑26316 | High | Failure to validate the communication buffer and communication service in the BIOS may allow an attacker to tamper with the buffer resulting in potential SMM (System Management Mode) arbitrary code execution. |
CVE‑2021‑26346 | Medium | Failure to validate the integer operand in ASP (AMD Secure Processor) bootloader may allow an attacker to introduce an integer overflow in the L2 directory table in SPI flash resulting in a potential denial of service. |
CVE‑2021‑46795 | Low | A TOCTOU (time-of-check to time-of-use) vulnerability exists where an attacker may use a compromised BIOS to cause the TEE OS to read memory out of bounds that could potentially result in a denial of service. |
DESKTOP
CVE | AMD Ryzen™ 2000 series Desktop Processors “Raven Ridge” AM4 |
AMD Ryzen™ 2000 Series Desktop Processors “Pinnacle Ridge” |
AMD Ryzen™ 3000 Series Desktop Processors “Matisse” AM4 |
AMD Ryzen™ 5000 Series Desktop Processors “Vermeer” AM4 |
AMD Ryzen™ 5000 Series Desktop Processor with Radeon™ Graphics “Cezanne” AM4 |
Minimum version to mitigate all listed CVEs | Raven-FP5-AM4 1.1.0.D ComboAM4PI 1.0.0.8 ComboAM4v2 PI 1.2.0.4 PinnaclePI-AM4 1.0.0.C |
PinnaclePI-AM4 1.0.0.C ComboAM4PI 1.0.0.8 ComboAM4v2 PI 1.2.0.4 |
N/A | N/A | ComboAM4v2 PI 1.2.0.8 |
CVE‑2021‑26316 | Raven-FP5-AM4 1.1.0.D ComboAM4PI 1.0.0.8 ComboAM4v2 PI 1.2.0.4 PinnaclePI-AM4 1.0.0.C |
PinnaclePI-AM4 1.0.0.C ComboAM4PI 1.0.0.8 ComboAM4v2 PI 1.2.0.4 |
N/A | N/A | ComboAM4v2 PI 1.2.0.4 |
CVE‑2021‑26346 | N/A | N/A | N/A | N/A | ComboAM4v2 PI 1.2.0.8 |
CVE‑2021‑46795 | N/A | N/A | N/A | N/A | ComboAM4v2 PI 1.2.0.5 |
HIGH END DESKTOP
CVE | 2nd Gen AMD Ryzen™ Threadripper™ Processors “Colfax” |
3rd Gen AMD Ryzen™ Threadripper™ Processors “Castle Peak” HEDT |
Minimum version to mitigate all listed CVEs | SummitPI-SP3r2 1.1.0.5 | CastlePeakPI-SP3r3 1.0.0.6 |
CVE‑2021‑26316 | SummitPI-SP3r2 1.1.0.5 | CastlePeakPI-SP3r3 1.0.0.6 |
CVE‑2021‑26346 | N/A | N/A |
CVE‑2021‑46795 | N/A | N/A |
WORKSTATION
CVE | AMD Ryzen™ Threadripper™ PRO Processors “Castle Peak” WS |
AMD Ryzen™ Threadripper™ PRO Processors “Chagall” WS |
Minimum version to mitigate all listed CVEs | CastlePeakWSPI-sWRX8 1.0.0.7 ChagallWSPI-sWRX8 0.0.9.0 |
N/A |
CVE‑2021‑26316 | CastlePeakWSPI-sWRX8 1.0.0.7 ChagallWSPI-sWRX8 0.0.9.0 |
N/A |
CVE‑2021‑26346 | N/A | N/A |
CVE‑2021‑46795 | N/A | N/A |
MOBILE – AMD Athlon Series
CVE | AMD Athlon™ 3000 Series Mobile Processors with Radeon™ Graphics “Dali”/”Dali” ULP |
AMD Athlon™ 3000 Series Mobile Processors with Radeon™ Graphics “Pollock” |
Minimum version to mitigate all listed CVEs | PicassoPI-FP5 1.0.0.D | PollockPI-FT5 1.0.0.3 |
CVE‑2021‑26316 | PicassoPI-FP5 1.0.0.D | PollockPI-FT5 1.0.0.3 |
CVE‑2021‑26346 | N/A | N/A |
CVE‑2021‑46795 | N/A | N/A |
MOBILE – AMD Ryzen Series
CVE | AMD Ryzen™ 2000 Series Mobile Processors “Raven Ridge” FP5 |
AMD Ryzen™ 3000 Series Mobile processor, 2nd Gen AMD Ryzen™ Mobile Processors with Radeon™ Graphics “Picasso” |
AMD Ryzen™ 3000 Series Mobile Processors with Radeon™ Graphics “Renoir” FP6 |
AMD Ryzen™ 5000 Series Mobile Processors with Radeon™ Graphics “Lucienne” |
AMD Ryzen™ 5000 Series Mobile Processors with Radeon™ Graphics “Cezanne” |
AMD Ryzen™ 6000 Series Mobile Processors “Rembrandt” |
Minimum version to mitigate all listed CVEs | N/A | PicassoPI-FP5 1.0.0.D ComboAM4PI 1.0.0.8 ComboAM4v2 PI 1.2.0.4 | RenoirPI-FP6 1.0.0.9 ComboAM4v2 PI 1.2.0.8 |
CezannePI-FP6 1.0.0.B | CezannePI-FP6 1.0.0.B | N/A |
CVE‑2021‑26316 | N/A | PicassoPI-FP5 1.0.0.D ComboAM4PI 1.0.0.8 ComboAM4v2 PI 1.2.0.4 | RenoirPI-FP6 1.0.0.7 ComboAM4v2 PI 1.2.0.4 | CezannePI-FP6 1.0.0.6 | CezannePI-FP6 1.0.0.6 | N/A |
CVE‑2021‑26346 | N/A | N/A | RenoirPI-FP6 1.0.0.9 ComboAM4v2 PI 1.2.0.8 |
CezannePI-FP6 1.0.0.B | CezannePI-FP6 1.0.0.B | N/A |
CVE‑2021‑46795 | N/A | N/A | RenoirPI-FP6 1.0.0.7 ComboAM4v2 PI 1.2.0.5 | CezannePI-FP6 1.0.0.6 | CezannePI-FP6 1.0.0.6 | N/A |
News Sources: Tom’s Hardware, AMD Client Vulnerabilities – January 2023, AMD Server Vulnerabilities – January 2023
AMD Confirms Ryzen 7000 “Raphael” CPU Launch This Quarter, High-End RDNA 3 GPUs & EPYC Genoa On Track For Late 2022
During the earnings call for its record Q2 2022 financials, AMD’s CEO, Lisa Su confirmed the launch of Ryzen 7000 CPUs, RDNA 3 GPUs, and EPYC Genoa chips in the coming months of 2022.
AMD Confirms Ryzen 7000 With Zen 4 Cores For Q3 2022, High-End RDNA 3 GPUs & EPYC Genoa CPUs Coming Later This Year
AMD posted a record quarter just a few hours ago with a 70% increase in revenue year over year with the Data Center Revenue alone climbing to $1.5 Billion in Q2 2022.
AMD Ryzen 7000 “Raphael” CPUs Launching This Quarter
So first of all, let’s get the big fish out of the way. AMD’s CEO, Lisa Su, confirmed that the red team will be launching its Ryzen 7000 Desktop CPUs, codenamed Raphael, and based on the Zen 4 core architecture to store shelves this quarter. While the exact date hasn’t been mentioned, it looks like the leaked September launch might be becoming a reality. The launch will not only include the CPU lineup but will also come with brand new 600-series motherboards such as the X670E & X670 that are supposed to be part of the first wave along with four chips that are presumably going to make up the initial “X” series lineup.
Looking ahead, we are on track to launch our all-new 5-nanometer Ryzen 7000 desktop processors and AM5 platforms later this quarter, with leadership performance in gaming and content creation.
Lisa Su, AMD CEO (Q2 2022 Earnings Call)
AMD Radeon RX 7000 “RDNA 3” GPUs Launching Late 2022
AMD also reaffirmed that the company would be launching its “High-End” RDNA 3 GPUs later this year. This looks similar to the Zen 3 and RDNA 2 launch which were launched just months apart. It looks like we may get a teaser of the RDNA 3 Radeon RX 7000 GPUs during the Ryzen 7000 launch but the official launch would take place either in October or November. AMD focusing on the high-end first means that they will have their top-end solution compete directly against NVIDIA’s high-end Ada Lovelace graphics cards.
While we expect the gaming graphics market to be down in the third quarter, we remain focused on executing our GPU roadmap, including launching our high-end RDNA three GPUs later this year.
Lisa Su, AMD CEO (Q2 2022 Earnings Call)
AMD EPYC 9000 “Genoa” CPUs On-Track For 2022 Launch
Lastly, we have AMD confirming that their EPYC 9000 “Genoa” CPUs are on track for launch by the end of this year. The company is seeing huge demand for Genoa already and is also working to get Bergamo “Zen 4C” out by early next year along with the 3D V-cache boosted Genoa-X chips in 2022.
Looking ahead, customer pull for our next-generation 5-nanometer generalist server CPU is very strong. We are on track to launch and ramp production of Genoa as the industry’s highest performance general-purpose server CPU later this year, positioning our data center business for continued growth and share gains.
In addition to Genoa, we have our Bergamo, which is a cloud-optimized capability as well that’s coming online early next year. So there’s a lot of new products that are supporting sort of our growth ambitions.
From what we see today, again, there is a strong customer pull on Genoa.
Lisa Su, AMD CEO (Q2 2022 Earnings Call)
Overall, AMD looks to be set to achieve some serious market share in the server and client PC segment with upcoming Ryzen, Radeon, and EPYC products. We can’t wait to see what AMD is coming out within the next few months.
AMD EPYC Genoa With 96 Zen 4 Cores Is An Insanely Fast Chip, Crushes Every Other x86 Processor In Leaked Benchmarks
The latest benchmarks of AMD’s upcoming EPYC Genoa 96 Core CPU based on the Zen 4 core architecture have been leaked by Yuuki_AnS. The leaked benchmarks show record-breaking x86 performance and this is coming from an engineering sample.
AMD’s EPYC Genoa 96 Core “Zen 4” CPU Crushes Every Single x86 Processor On The Market
The AMD EPYC Genoa 9000 chip that has leaked out is one of the many Zen 4 server CPUs that the red team will be launching later this year for the server market. We recently covered the specs for the entire lineup from the same source and now, Yuuki_AnS has posted the very first benchmarks which show monstrous performance for the engineering sample.
The specific AMD EPYC Genoa CPU’s OPN code and SKU naming have not been mentioned but our guess is this could be the EPYC 9654P which is one of the SKUs that feature the same specifications which includes 96 cores and 192 threads based on the Zen 4 core architecture. The chip rocks 384 MB of L3 cache and has a base frequency of 2.15 GHz. The boost frequencies are rated at 3.05 GHz for all cores, 3.5-3.7 GHz single-core frequencies, and a 3.5 GHz low-usage operating frequency. At full load, the chip consumes 360 Watts of power which is a very reasonable figure given that Intel’s chips have a maximum power limit of over 700W.
AMD EPYC 9000 Genoa CPU SKUs ‘Preliminary’ Specs:
CPU Name | Cores / Threads | Cache | Clock Speeds | TDP | State |
---|---|---|---|---|---|
EPYC 9654P | 96/192 | 384 MB | 2.0-2.15 GHz | 360W | Production Ready |
EPYC 9534 | 64/128 | 256 MB | 2.3-2.4 GHz | 280W | Production Ready |
EPYC 9454P | 48/96 | 256 MB | 2.25-2.35 GHz | 290W | Production Ready |
EPYC 9454 | 48/96 | 256 MB | 2.25-2.35 GHz | 290W | Production Ready |
EPYC 9354P | 32/64 | 256 MB | 2.75-2.85 GHz | 280W | Production Ready |
EPYC 9354 | 32/64 | 256 MB | 2.75-2.85 GHz | 280W | Production Ready |
EPYC 9334 | 32/64 | 128 MB | 2.3-2.5 GHz | 210W | Production Ready |
EPYC 9274F | 24/48 | 256 MB | 3.4-3.6 GHz | 320W | Production Ready |
EPYC 9254 | 24/48 | 128 MB | 2.4-2.5 GHz | 200W | Production Ready |
EPYC 9224 | 24/48 | 64 MB | 2.15-2.25 GHz | 200W | Production Ready |
EPYC 9174F | 16/32 | 256 MB | 3.6-3.8 GHz | 320W | Production Ready |
EPYC 9124 | 16/32 | 64 MB | 2.6-2.7 GHz | 200W | Production Ready |
EPYC 9000 (ES) | 96/192 | 384 MB | 2.0-2.15 GHz | 320-400W | ES |
EPYC 9000 (ES) | 84/168 | 384 MB | 2.0 GHz | 290W | ES |
EPYC 9000 (ES) | 64/128 | 256 MB | 2.5-2.65 GHz | 320-400W | ES |
EPYC 9000 (ES) | 48/96 | 256 MB | 3.2-3.4 GHz | 360W | ES |
EPYC 9000 (ES) | 32/64 | 256 MB | 3.2-3.4 GHz | 320W | ES |
EPYC 9000 (ES) | 32/64 | 256 MB | 2.7-2.85 GHz | 260W | ES |
AMD’s EPYC Genoa 96 Core ES CPU was tested in a dual-socket configuration so that’s 192 cores and 384 threads in total. However, existing benchmarks do not support more than 128 cores as mentioned by the leaker and the performance was measured within Windows Server 2025 preview so we are looking at a very non-optimized testing ecosystem. It is stated that the performance gap between the ES part tested here and the final version will be huge so we can expect even higher performance on the retail chips.
AMD EPYC Genoa 96 Core & Intel Sapphire Rapids-SP CPU Benchmarks (Image Credits: Yuuki_AnS):
0
15000
30000
45000
60000
75000
90000
The performance metrics shared are within various versions of CPU-z, V-Ray, and the very popular Cinebench benchmarks. In CPU-z v17, the AMD EPYC Genoa 96 Core CPU scored 740.2 points in the single-thread and 73057.5 points in the multi-thread benchmark. In CPU-z AVX-512, the chip scored 627.2 points in single-core and 15625.1 points in multi-core tests. For comparison, the AMD Ryzen Threadripper Pro 3995WX with 64 Zen 2 cores has a multi-threaded performance of 30,917 points so that’s a 2.36x improvement in multi-threaded performance. In the leaked benchmarks results that compare the chip with unreleased Sapphire Rapids-SP offerings, the CPU lacks behind in the single-threaded benchmarks but blazes past its rival in the multi-threading workloads.
0
15000
30000
45000
60000
75000
90000
In V-Ray, the chip scored 88,300 points in the multi-core benchmark test. For comparison, AMD’s own Ryzen Threadripper PRO 5995WX benchmarks show a performance rating of 60,111 points for the 64 Core Zen 3 chip. This is a 47% improvement which is massive but do note that this isn’t even the final form of the 96 core Genoa flagship. In the leaked benchmarks, the chip offers a 4.5% CPU performance improvement over its predecessor, the EPYC 7773X which is expected due to the low clock speeds that the ES chip was operating at.
0
16796
33592
50388
67184
83980
100776
Lastly, we have the Cinebench performance benchmarks which were tested across all three versions (R15, R20, R23). In Cinebench R15, the chip scored 188 points in single-core and 11,577 points in multi-core, In Cinebench R20, the chip scored 416 points in single-core and 26,285 points in multi-core while in Cinebench R23, the chip scored 1227 points in single-core and 100,776 points in multi-core tests. Here, the CPU destroys the Intel offerings but do note that only 128 cores are being utilized across all three versions and at a lower clock frequency too which is a far cry from its final 3.05 GHz all-core boost.
AMD’s EPYC Genoa CPUs will feature 128 PCIe Gen 5.0 lanes, 160 for a 2P (dual-socket) configuration. The SP5 platform will also feature DDR5-5200 memory support which is some insane improvement over the existing DDR4-3200 MHz DIMMs. But that’s not all, it will also support up to 12 DDR5 memory channels and 2 DIMMs per channel which will allow up to 3 TB of system memory using 128 GB modules. The AMD EPYC 9000 Genoa CPU lineup is expected to launch in the second half of this year.
AMD EPYC Milan Zen 3 vs EPYC Genoa Zen 4 Size Comparisons:
CPU Name | AMD EPYC Milan | AMD EPYC Genoa |
---|---|---|
Process Node | TSMC 7nm | TSMC 5nm |
Core Architecture | Zen 3 | Zen 4 |
Zen CCD Die Size | 80mm2 | 72mm2 |
Zen IOD Die Size | 416mm2 | 397mm2 |
Substrate (Package) Area | TBD | 5428mm2 |
Socket Area | 4410mm2 | 6080mm2 |
Socket Name | LGA 4094 | LGA 6096 |
Max Socket TDP | 450W | 700W |
AMD EPYC Genoa Server CPU & SP5 Socket With Heatsink Gets Close Up Shots, Massive Chip With Massive Performance
AMD’s EPYC Genoa 9000 CPUs and the accompanying SP5 socket with its heatsink have been pictured once again. The next-gen EPYC lineup is going to feature a monstrous amount of performance packed under the hood with up to 96 cores and 400W TDPs as disclosed within specifications that leaked a few days ago.
AMD EPYC Genoa 9000 CPU With Zen 4 Cores & SP5 Socket With Heatsink Pictured – Big, Badass, and Blazing Fast Server Chip
The AMD EPYC Genoa 9000 CPUs feature support for new memory and new capabilities. In the most recent details from the company, reports state that the SP5 platform will also introduce a brand new socket, featuring a massive 6096 pins arranged in the LGA socket format. This processor will be AMD’s most significant socket design, adding 2002 pins more than the current LGA 4094 socket set.
For AMD to access those 96 cores, the company has to cramp more cores into its EPYC Genoa CPU package. AMD will achieve this by incorporating up to 12 CCDs. Each CCD will offer eight cores based on the new upcoming Zen 4 architecture. That aligns with the expanded socket size and could be witnessing a considerable CPU interposer — much more prominent than current EPYC CPUs. The processor is reported to feature a 320W TDP which can be configurable to up to 400W.
AMD EPYC Milan Zen 3 vs EPYC Genoa Zen 4 Size Comparisons:
CPU Name | AMD EPYC Milan | AMD EPYC Genoa |
---|---|---|
Process Node | TSMC 7nm | TSMC 5nm |
Core Architecture | Zen 3 | Zen 4 |
Zen CCD Die Size | 80mm2 | 72mm2 |
Zen IOD Die Size | 416mm2 | 397mm2 |
Substrate (Package) Area | TBD | 5428mm2 |
Socket Area | 4410mm2 | 6080mm2 |
Socket Name | LGA 4094 | LGA 6096 |
Max Socket TDP | 450W | 700W |
Photos of the socket have been seen before online, but the new designs showcase at a much higher resolution in the recent photo set. Likewise, we also see a picture of the SP5 heatsink that will be attached with up to eight Torx screws.
The next-gen data center AMD EPYC Genoa CPUs will launch in Q4 2022 and is anticipated to show before rival Intel reveals the mass production of its Xeon Sapphire Rapids. It is also reported that both AMD and Intel processors have been available to select customers for premature deployment and testing.
News Sources: Twitter, Reddit, VideoCardz
AMD EPYC Genoa “Zen4” CPU gets pictured some more along with its massive SP5 socket and heatsink
AMD EPYC Genoa poses for new photos
Earlier this week YuuKi_AnS revealed the specs of the EPYC 9004 series based on Genoa silicon. These are the upcoming data-center series featuring AMD Zen4 architecture. Based on this information, the new EPYC will feature up to 96 cores and 360W of TDP, a 50% increase in cores and 28% in TDP compared to Zen3 EPYC Milan series.
EPYC Genoa will be encapsulated into a new AMD SP5 package and for LGA-6096. This basically means that Genoa will require entirely new motherboards and as a result new cooling solutions.
AMD EPYC Genoa Engineering Sample, Source: YuuKi_Ans/Reddit
The photos of this new socket have been posted before, but the new ones might be the highest resolution of them yet. Furthermore, there is a photo of the SP5 heatsink attached with as many as 8 torx screws.
AMD SP5 socket and heatsink, Source: YuuKi_Ans/Reddit
AMD Genoa is set to launch in the fourth quarter this year, most likely before Intel deploys its Xeon Sapphire Rapids in volume. Both processors have already been available to first customers, either for early deployment or for testing. In any case, this is how such photos end up posted online.
Source: YuuKi_AnS, Reddit
AMD EPYC 7004 “Genoa” die has been pictured, features twelve Zen4 chiplets
AMD Epyc Genoa with 12 chiplets pictured
Just yesterday the first photo of the new SP5 (LGA6096) socket has emerged and now we finally get to see the next-gen EPYC processor without the integrated heatspreader.
A Chiphell forum member “zhangzhonghao” appears to be the first person to reveal the real picture of the upcoming Zen4 server processor, codenamed Genoa. It is the first photograph showing all 12 chiplets installed on the SP5 package.
AMD EPYC “Genoa” CPU, Source: Chiphell
EPYC Genoa feature up to 96 cores and 192 threads in its full configuration. AMD will release many SKUs with partially disabled cores, so just because this processor has 12 chiplets it does not mean it will have all 96 cores active.
Each Zen4 CCD die has an area of 72 mm², which is 8 mm² smaller than Zen3 (such as on EPYC “Milan” series). The I/O die is smaller as well, around 397 mm² compared to 416 mm² on Zen3 EPYC CPUs. That said, AMD had no trouble fitting 6 chiplets on each side of the I/O die, considering that the SP5 (LGA 6096) package is also 37% bigger than SP3.
AMD 16-core EPYC Genoa processor, Source: VideoCardz
AMD’s new SP5 platform will support up to 12-channel DDR5 memory as well PCIe Gen5 interface. AMD Genoa is already shipping to first customers, according to AMD. The new EPYC 7004 series are now on track to launch by the end of this year.
RUMORED AMD EPYC Processor Series Specifications | ||||||
---|---|---|---|---|---|---|
VideoCardz | 7001 “Naples” | 7002 “Rome” | 7003 “Milan” 7003 “Milan-X” (*) |
7004 “Genoa” | 7004 “Bergamo” | 7005 “Turin” |
Launch | 2017 | 2019 | 2021 | 2022 | 2022 | 2023/2024 |
Architecture | 14nm Zen | 7nm Zen2 | 7nm Zen3 | 5nm Zen4 | 5nm Zen4c | Zen5 |
Socket | SP3 (LGA4094) | SP3 (LGA4094) | SP3 (LGA4094) | SP5 (LGA-6096) | SP5 (LGA-6096) | SP5 (LGA-6096) |
Modules/Chiplets | 4xCCD | 8xCCD + 1xIOD | 8xCCD + 1xIOD | 12xCCD + 1xIOD | 12xCCD + 1xIOD | TBC |
Max Cores | ||||||
Max Clock | TBC | TBC | TBC | |||
L2 Cache Per Core | 0.5 MB | 0.5 MB | 0.5 MB | 1 MB | TBC | TBC |
L3 Cache Per CCX | 8 MB | 8 MB | 32 MB / 96 MB (*) | 32 MB | TBC | TBC |
Memory Channels | ||||||
Memory Support | ||||||
PCIe Lanes | TBC | TBC | ||||
Max cTDP | TBC |
Source: zhangzhonghao @ Chiphell via @9550pro
EPYC 7003 Up to 64 Cores and 768 MB L3 Cache
There’s been a lot of focus on how both Intel and AMD are planning for the future in packaging their dies to increase overall performance and mitigate higher manufacturing costs. For AMD, that next step has been V-cache, an additional L3 cache (SRAM) chiplet that’s designed to be 3D die stacked on top of an existing Zen 3 chiplet, tripling the total about of L3 cache available. Today, AMD’s V-cache technology is finally available to the wider market, as AMD is announcing that their EPYC 7003X “Milan-X” server CPUs have now reached general availability.
As first announced late last year, AMD is bringing its 3D V-Cache technology to the enterprise market through Milan-X, an advanced variant of its current-generation 3rd Gen Milan-based EPYC 7003 processors. AMD is launching four new processors ranging from 16-cores to 64-cores, all of them with Zen 3 cores and 768 MB L3 cache via 3D stacked V-Cache.
AMD’s Milan-X processors are an upgraded version of its current 3rd generation Milan-based processors, EPYC 7003. Adding to its preexisting Milan-based EPYC 7003 line-up, which we reviewed back in June last year, the most significant advancement from Milan-X is through its large 768 MB of L3 cache using AMD’s 3D V-Cache stacking technology. The AMD 3D V-Cache uses TSMC’s N7 process node – the same node Milan’s Zen 3 chiplets are built upon – and it measures at 36 mm², with a 64 MiB chip on top of the existing 32 MiB found on the Zen 3 chiplets.
Focusing on the key specifications and technologies, the latest Milan-X AMD EPYC 7003-X processors have 128 available PCIe 4.0 lanes that can be utilized through full-length PCIe 4.0 slots and controllers selection. This is dependent on how motherboard and server vendors want to use them. There are also four memory controllers that are capable of supporting two DIMMs per controller which allows the use of eight-channel DDR4 memory.
The overall chip configuration for Milan-X is a giant, nine chiplet MCM, with eight CCD dies and a large I/O die, and this goes for all of the Milan-X SKUs. Critically, AMD has opted to equip all of their new V-cache EPYC chips with the maximum 768 MB of L3 cache, which in turn means all 8 CCDs must be present, from the top SKU (EPYC 7773X) to the bottom SKU (EPYC 7373X). Instead, AMD will be varying the number of CPU cores enabled in each CCD. Drilling down, each CCD includes 32 MB of L3 cache, with a further 64 MB of 3D V-Cache layered on top for a total of 96 MB of L3 cache per CCD (8 x 96 = 768).
In terms of memory compatibility, nothing has changed from the previous Milan chips. Each EPYC 7003-X chip supports eight DDR4-3200 memory modules per socket, with capacities of up to 4 TB per chip and 8 TB across a 2P system. It’s worth noting that the new Milan-X EPYC 7003-X chips share the same SP3 socket as the existing line-up and, as such, are compatible with current LGA 4094 motherboards through a firmware update.
AMD EPYC 7003 Milan/Milan-X Processors | |||||||||
AnandTech | Core/ Thread |
Base Freq |
1T Freq |
L3 Cache |
PCIe | Memory | TDP (W) |
Price (1KU) |
|
EYPC 7773X | 64 | 128 | 2200 | 3500 | 768 MB | 128 x 4.0 | 8 x DDR4-3200 | 280 | $8800 |
EPYC 7763 | 64 | 128 | 2450 | 3400 | 256 MB | 128 x 4.0 | 8 x DDR4-3200 | 280 | $7890 |
EPYC 7573X | 32 | 64 | 2800 | 3600 | 768 MB | 128 x 4.0 | 8 x DDR4-3200 | 280 | $5590 |
EPYC 75F3 | 32 | 64 | 2950 | 4000 | 256 MB | 128 x 4.0 | 8 x DDR4-3200 | 280 | $4860 |
EPYC 7473X | 24 | 48 | 2800 | 3700 | 768 MB | 128 x 4.0 | 8 x DDR4-3200 | 240 | $3900 |
EPYC 74F3 | 24 | 78 | 3200 | 4000 | 256 MB | 128 x 4.0 | 8 x DDR4-3200 | 240 | $2900 |
EPYC 7373X | 16 | 32 | 3050 | 3800 | 768 MB | 128 x 4.0 | 8 x DDR4-3200 | 240 | $4185 |
EPYC 73F3 | 16 | 32 | 3500 | 4000 | 256 MB | 128 x 4.0 | 8 x DDR4-3200 | 240 | $3521 |
Looking at the new EPYC 7003 stack with 3D V-Cache technology, the top SKU is the EPYC 7773X. It features 64 Zen3 cores with 128 threads has a base frequency of 2.2 GHz and a maximum boost frequency of 3.5 GHz. The EPYC 7573X has 32-cores and 64 threads, with a higher base frequency of 2.8 GHz and a boost frequency of up to 3.6 GHz. Both the EPYC 7773X and 7573X have a base TDP of 280 W, although AMD specifies that all four EPYC 7003-X chips have a configurable TDP of between 225 and 280 W.
The lowest spec chip in the new line-up is the EPYC 7373X, which has 16 cores with 32 threads, a base frequency of 3.05 GHz, and a boost frequency of 3.8 GHz. Moving up the stack, it also has a 24c/48t option with a base frequency of 2.8 GHz and a boost frequency of up to 3.7 GHz. Both include a TDP of 240 W, but like the bigger parts, AMD has confirmed that both 16-core and 24-core models will have a configurable TDP of between 225 W and 280 W.
Notable, all of these new Milan-X chips have some kind of clockspeed regression over their regular Milan (max core performance) counterparts. In the case of the 7773X, this is the base clockspeed, while the other SKUs all drop a bit on both base and boost clockspeeds. The drop is necessitated by the V-cache, which at about 26 billion extra transistors for a full Milan-X configuration, eats into the chips’ power budget. So with AMD opting to keep TDPs consistent, clockspeeds have been dialed down a bit to compensate. As always, AMD’s CPUs will run as fast as heat and TDP headroom allows, but the V-cache equipped chips are going to reach those limits a bit sooner.
AMD’s target market for the new Milan-X chips is customers who need to maximize per-core performance; specifically, the subset of workloads that benefit from the extra cache. This is why the Milan-X chips aren’t replacing the EPYC 70F3 chips entirely, as not all workloads are going to respond to the extra cache. So both lineups will be sharing the top spot as AMD’s fastest-per-core EPYC SKUs.
For their part, AMD is particularly pitching the new chips at the CAD/CAM market, for tasks such as finite element analysis and electronic design automation. According to the company, they’ve seen upwards of a 66% increase in RTL verification speeds on Synopsys’ VCS verification software in an apples-to-apples comparison between Milan processors with and without V-cache. As with other chips that incorporate larger caches, the greatest benefits are going to be found in workloads that spill out of contemporary-sized caches, but will neatly fit into the larger cache. Minimizing expensive trips to main memory means that the CPU cores can remain working that much more often.
Microsoft found something similar last year, when they unveiled a public preview of its Azure HBv3 virtual machines back in November. At the time, the company published some performance figures from its in-house testing, mainly on workloads associated with HPC. Comparing Milan-X directly to Milan, Microsoft used data from both EPYC 7003 and EPYC 7003-X inside its HBv3 VM platforms. It’s also worth noting that the testing was done on dual-socket systems, as all of the EPYC 7003-X processors announced today could be used in both 1P and 2P deployments.
Performance data published by Microsoft Azure is encouraging and using its in-house testing, it looks as though the extra L3 cache is playing a big part. In Computational Fluid Dynamics, it was noted that there was a better speed up with fewer elements, so that has to be taken into consideration. Microsoft stated that with its current HBv3 series, its customers can expect maximum gains of up to 80% performance in Computational Fluid Dynamics compared to the previous HBv3 VM systems with Milan.
Wrapping things up, AMD’s EPYC 7003-X processors are now generally available to the public. With prices listed on a 1K unit order basis, AMD says the EPYC 7773X with 64C/128T will be available for around $8800, while the 32C/64T model, the EPYC 7573X, will cost about $5590. Moving down, the EPYC 7473X with 24C/48T will cost $3900, and the entry EPYC 7373X with 16C/32T will cost slightly more with a cost of $4185.
Given the large order sizes required, the overall retail price is likely to be slightly higher for one unit. Though with the majority of AMD’s customers being server and cloud providers, no doubt AMD will have some customers buying in bulk. Many of AMD’s major server OEM partners are also slated to begin offering systems using the new chips, including Dell, Supermicro, Lenovo, and HPE.
Finally, consumers will get their own chance to get their hands on some AMD V-cache enabled CPUs next month, when AMD’s second V-cache product, the Ryzen 7 5800X3D, is released. The desktop processor is based around a single CCD with a whopping 96 MB of L3 cache available, all of which contrasts nicely with the much bigger EPYC chips.