Tag Archives: Chipset

Qualcomm says most Windows games will work on its latest Arm laptop chipset – Engadget

  1. Qualcomm says most Windows games will work on its latest Arm laptop chipset Engadget
  2. Qualcomm says most Windows games should “just work” on its unannounced Arm laptops The Verge
  3. Unlike Apple’s chips, Qualcomm’s X Elite Arm CPU will run Windows games just fine using x64 emulation — native ARM64 code will give best performance Tom’s Hardware
  4. Qualcomm claims Windows games ‘just work’ on its new Arm laptop chip PC Gamer
  5. Qualcomm Says That Laptops With The Snapdragon X Elite Will Be Able To Run Most Games, But Developers Will Still Be Given Three Options Wccftech

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Desktop Intel Arrow Lake-S appears to follow Apple M SoCs with no Hyperthreading as internal documents leak key specs and chipset details – Notebookcheck.net

  1. Desktop Intel Arrow Lake-S appears to follow Apple M SoCs with no Hyperthreading as internal documents leak key specs and chipset details Notebookcheck.net
  2. Intel’s next-gen Arrow Lake CPUs might come without hyperthreaded cores — leak points to 24 CPU cores, DDR5-6400 support, and a new 800-series chipset Tom’s Hardware
  3. Intel’s Arrow Lake specs break cover: Say hello to DDR5-6400, wave goodbye to DDR4 and possibly Hyper-Threading PC Gamer
  4. Intel’s Arrow Lake CPUs Will Allegedly Ditch Hyper-Threading: Leak ExtremeTech
  5. Intel Arrow Lake-S Platform: Technical Specifications, Native Thunderbolt guru3d.com

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Leaked documents list Intel Arrow Lake-S with 8P+16E cores, 125W TDP, full 800-series chipset details – VideoCardz.com

  1. Leaked documents list Intel Arrow Lake-S with 8P+16E cores, 125W TDP, full 800-series chipset details VideoCardz.com
  2. Intel’s next-gen Arrow Lake CPUs might come without hyperthreaded cores — leak points to 24 CPU cores, DDR5-6400 support, and a new 800-series chipset Tom’s Hardware
  3. Intel Arrow Lake-S Desktop CPU Platform Leaks Out: 24 CPU Cores, DDR5-6400, 800-Series Motherboard Support Wccftech
  4. Intel 15th Gen Arrow Lake-S CPU Specs Leak Out: 24 Cores, no Hyper-Threading, and 125W TDP Hardware Times
  5. CPU-Z now works with ARM64 CPUs on Windows PCWorld

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AYANEO Pocket S: Launch window and new Snapdragon G3x Gen 2 chipset confirmed for powerful Android gaming handheld – Notebookcheck.net

  1. AYANEO Pocket S: Launch window and new Snapdragon G3x Gen 2 chipset confirmed for powerful Android gaming handheld Notebookcheck.net
  2. New AYANEO Pocket S Announced And It Looks Incredible Retro Dodo
  3. Ayaneo reveals Pocket S handheld with brand-new Snapdragon chipset Dexerto
  4. New Android Handheld Could Be the Best Way to Play Mobile Games Like Genshin Impact and Fortnite Prima Games
  5. AYN Odin2: New gaming handheld released with 6-inch display and Qualcomm Snapdragon 8 Gen 2 chipset at cheaper than expected pricing Notebookcheck.net
  6. View Full Coverage on Google News

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Tensor G3: Google Pixel 8 series chipset fails to match the Snapdragon 8+ Gen 1 in early Geekbench appearance – Notebookcheck.net

  1. Tensor G3: Google Pixel 8 series chipset fails to match the Snapdragon 8+ Gen 1 in early Geekbench appearance Notebookcheck.net
  2. Pixel 8’s Tensor G3 gets leaked detailing all of its main specs XDA Developers
  3. Tensor G3 Delivers Poor Showing In Geekbench’s Single & Multi-Core Results, Though There’s A Chance The Leak Is Fake Wccftech
  4. Google Pixel 8’s Tensor G3 GeekBench scores reveals lackluster performance gizmochina
  5. Google Pixel 8 could get a major gaming and AI boost from leaked Tensor G3 chip TechRadar
  6. View Full Coverage on Google News

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Second tipster posts rumored specs for the chipset that will power the Galaxy S24 Ultra – PhoneArena

  1. Second tipster posts rumored specs for the chipset that will power the Galaxy S24 Ultra PhoneArena
  2. Massive Snapdragon 8 Gen 3 leak reveals surprising new core configuration and more TechSpot
  3. Qualcomm Snapdragon 8 Gen 3 specs leak online: 1+5+2 CPU core arrangement tipped along with support for UFS 4.1 storage Notebookcheck.net
  4. Galaxy S24 Snapdragon 8 Gen 3 could support UFS 4.1 and crush Geekbench SamMobile – Samsung news
  5. Snapdragon 8 Gen 3 Specifications Revealed In Massive Leak, Fewer Efficiency Cores, Next-Gen UFS Support, More Highlighted Wccftech
  6. View Full Coverage on Google News

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Samsung Galaxy Book 2 Go gets upgraded with Snapdragon 7c+ Gen 3 chipset

After unveiling a newer version of the Galaxy Book 2 Pro 360 laptop with a more powerful processor (Snapdragon 8cx Gen 3), Samsung has launched the Galaxy Book 2 Go with a newer chipset. This ARM-based Windows laptop succeeds last year’s Galaxy Book Go and brings a newer and more powerful Qualcomm processor, the Snapdragon 7c+ Gen 3.

Galaxy Book 2 Go with Snapdragon 7c+ Gen 3 has a 40% faster CPU, 35% faster GPU

Samsung is claiming the Galaxy Book 2 Go to be a compact-yet-powerful laptop. It comes equipped with the Qualcomm Snapdragon 7c+ Gen 3 chipset that features a 40% faster CPU and a 35% more powerful GPU compared to the Snapdragon 7c Gen 2 that was used in the Galaxy Book Go. The new chipset also brings faster wireless connectivity features, including Wi-Fi 6E and Bluetooth 5.2. It also supports faster LPDDR4X RAM (at 3,200MHz) and storage (NVMe SSD). Qualcomm also claims that it offers improved AI processing but doesn’t dive deeper into the metrics.

This new chipset is fabricated by TSMC on its 6nm node, which means it is quite power-efficient as well. It helps laptops last longer on a single charge, and Samsung claims that the Galaxy Book 2 Go can last all day or up to 21 hours for video playback. Although the chipset features 5G, Samsung seems to have disabled it on its Wi-Fi-only version of the Galaxy Book 2 Go. The company might launch the Galaxy Book 2 Go 5G sometime this year. It runs Windows 11 out of the box and comes with Galaxy ecosystem features like Galaxy Buds Auto Switch, Link To Windows, Multi Control (a Galaxy tablet), Quick Share, Samsung Notes, and Second Screen.

The other features of the Galaxy Book 2 Go include a 14-inch IPS LCD display with Full HD resolution and a 180-degree hinge. Looks like it has a tenkeyless keyboard layout, a large trackpad, and a webcam. Samsung hasn’t revealed the RAM, storage, and battery capacity of its new notebook. It is built to the MIL-STD-810G spec, which means it is resistant to drops, extreme temperatures, humidity, shocks, and vibrations. It is 15.5mm thin and weighs 1.44kg.

The Galaxy Book 2 Go will be available for purchase in France exclusively through Samsung.com starting January 20, 2023.

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AMD Ryzen 7000 3D V-Cache CPUs Rumored To Come In 8 & 6 Core Flavors, A620 Chipset & Next-Gen APUs Planned For Mid To Late 2023

AMD’s Ryzen 7000 CPU family will be further expanded in 2023 with the launch of the 3D V-Cache parts along with the entry-level A620 chipset.

AMD Ryzen 7000 CPU Rumors: 3D V-Cache Chips in 8/6 Core Flavors, A620 Chipset & Next-Gen APUs In 2023

As per Enthusiast Citizen at Bilibili, the leaker has reported that AMD has three major products that are planned for 2023.

AMD Ryzen 7000 3D V-Cache In 8-Core & 6-Core Flavors

The first and most obvious one is the Ryzen 7000 3D V-Cache lineup that was confirmed by us to be unveiled at CES 2023. It is reported that the lineup will have only two parts, an 8-core, and a 6-core variant. So it looks like we will be getting the Ryzen 7 7800X3D and the Ryzen 5 7600X 3D more or less. These CPUs will offer a 3D-Stacked chiplet design, featuring larger SRAM & providing users with higher gaming performance in cache-intensive titles. The result will be similar to the first-generation V-Cache chip, the Ryzen 7 5800X3D, which has become a popular chip due to its amazing performance and even more fantastic value.

APUs on AM5, Ryzen 7000G Planned For Late 2023

AMD won’t just stop at the 3D V-Cache parts, later in 2023, there is a next-gen AM5 Desktop APU lineup planned. This lineup will also fall under the Ryzen 7000 ‘G’ series family but is expected to launch in the second half of 2023. Currently, there’s no information available as to what these line of chips will offer but since they are going to be compatible with the AM5 platform, it is likely that these will be a variation of the Phoenix Point (Zen 4 + RDNA 3) APUs that will start shipping to mobiles in the early half of the year.

One interesting piece of information shared is that these Ryzen 7000 chips will only support DDR5-4800 memory which is a little lackluster considering APUs require all the bandwidth they can get. The chips will be available in 8-core and 6-core flavors too and there’s talk of enhanced models too though no information is provided yet.

A620 Taking AM5 To The Entry-Level

Finally, there’s an update on the A620 chipset platform. So far, AMD has confirmed X670 & B650 chipsets but the leaker states that the A620 chipset will be announced around Q2 2022 and will not offer CPU overclocking support. The entry-level platform would make sense with Non-X and low-end Ryzen 3 chips if AMD plans on launching them. This may solve the high pricing issue of the AM5 platform but given how restrictive the whole A620 chipset platform would be, it wouldn’t make sense to use these motherboards if you plan on benefiting from the longevity of the AM5 ecosystem.

AMD Zen CPU / APU Roadmap:

Zen Architecture Zen 1 Zen+ Zen 2 Zen 3 Zen 3+ Zen 4 Zen 5 Zen 6
Process Node 14nm 12nm 7nm 7nm 6nm? 5nm/4nm 4nm/3nm TBA
Server EPYC Naples (1st Gen) N/A EPYC Rome (2nd Gen) EPYC Milan (3rd Gen) N/A EPYC Genoa (4th Gen)
EPYC Genoa-X (4th Gen)
EPYC Siena (4th Gen)
EPYC Bergamo (5th Gen?)
EPYC Turin (6th Gen) EPYC Venice (7th Gen)
High-End Desktop Ryzen Threadripper 1000 (White Haven) Ryzen Threadripper 2000 (Coflax) Ryzen Threadripper 3000 (Castle Peak) Ryzen Threadripper 5000 (Chagal) N/A Ryzen Threadripper 7000 (Storm Peak) TBA TBA
Mainstream Desktop CPUs Ryzen 1000 (Summit Ridge) Ryzen 2000 (Pinnacle Ridge) Ryzen 3000 (Matisse) Ryzen 5000 (Vermeer) Ryzen 6000 (Warhol / Cancelled) Ryzen 7000 (Raphael) Ryzen 8000 (Granite Ridge) TBA
Mainstream Desktop . Notebook APU Ryzen 2000 (Raven Ridge) Ryzen 3000 (Picasso) Ryzen 4000 (Renoir)
Ryzen 5000 (Lucienne)
Ryzen 5000 (Cezanne)
Ryzen 6000 (Barcelo)
Ryzen 6000 (Rembrandt) Ryzen 7000 (Phoenix) Ryzen 8000 (Strix Point) TBA
Low-Power Mobile N/A N/A Ryzen 5000 (Van Gogh)
Ryzen 6000 (Dragon Crest)
TBA TBA TBA TBA TBA

News Source: Harukaze5719



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Samsung Galaxy M54 may have Snapdragon 888 chipset, 6,000mAh battery

The Galaxy M52 and the Galaxy M53 are really good mid-range smartphones, and it looks like Samsung will make the Galaxy M54 even better. The Galaxy M54 could come with a high-refresh-rate screen, a high-end processor, and a big battery.

According to the YouTube channel The Pixel, the Galaxy M54 could launch later this year or early next year. It reportedly features a 6.67-inch Super AMOLED display with Full HD+ resolution and a 90Hz refresh rate. The upcoming smartphone will reportedly come equipped with the Snapdragon 888 processor, 8GB RAM, and 128GB internal storage.

It could have a 32MP selfie camera, a 64MP primary rear camera, a 12MP ultrawide camera, and a 5MP macro camera. Whether or not it has OIS remains to be seen, but we can at least expect 4K video recording through front and rear cameras.

The Galaxy M54 is expected to come powered by a 6,000mAh battery and feature 25W fast charging. We can expect it to have a fingerprint reader, GPS, 5G, Wi-Fi 6, Bluetooth 5.0, and USB Type-C port as well. If the Galaxy M54 really comes with the Snapdragon 888 SoC, it could become one of the best mid-range Samsung Galaxy smartphones ever released.

Would you buy this phone? Let us know in the comments section below.

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AMD Announces B650 Extreme Chipset for Ryzen 7000: PCIe 5.0 For Mainstream

Over the last couple of months, the rumor mill surrounding AMD’s impending Ryzen 7000 processors for desktops has been in overdrive. Although Lisa Su unveiled Zen 4 back at CES 2022, it’s been anticipated that the new AM5 platform would include multiple chipsets, much like AM4 has over 500+ motherboard lifespan from X370, X470, X570, and every chipset in between.

AMD announced its X670E, X670, and B650 chipsets during the AMD Keynote at Computex 2022, and this evening, AMD has announced a fourth chipset for Ryzen 7000, the B650E chipset. The B650E chipset will run alongside the already announced B650 chipset, but as it’s part of AMD’s ‘Extreme’ series of chipsets, it will benefit from PCIe 5.0 lanes to at least one M.2 slot, as well as optional support for PCIe 5.0 to a PCIe graphics slot, features not available with standard B650 boards.

During AMD’s Keynote at Computex 2022, AMD’s CEO Lisa Su unveiled three AM5 chipsets designed to harness the power of its 5 nm Zen 4 cores within the Ryzen 7000 processors. We already knew the AM5 socket was based around a Lane Grid Array (LGA) socket with 1718 pins, aptly named LGA1718. Some of the significant benefits coming to AM5 include native PCIe 5.0 support from the CPU, not just for use with the PCIe slots, but also in the way of PCIe 5.0 storage, where the first consumer drives are expected to start rolling out in November 2022.

AMD’s latest announcement of the B650E (Extreme) chipset gives motherboard vendors and users the option of a lower-cost platform but without sacrificing the longevity and expansion support of PCIe 5.0. The X670E chipset is reserved for its most premium models, such as the flagship ASUS ROG Crosshair X670E Extreme motherboard, unveiled at Computex 2022.

AMD AM5 Chipset Comparison
Feature X670E X670 B650E B650
CPU PCIe (PCIe) 5.0 (Mandatory)
2 x16 Slots
4.0
(5.0 Optional)
4.0
(5.0 Optional)
4.0
(5.0 Optional)
CPU PCIe (M.2 Slots) At Least 1 PCIe 5.0 Slot PCIe 4.0
(5.0 Optional)
Total CPU PCIe Lanes 24
SuperSpeed USB 20Gbps
(USB 3.2 Gen 2×2)
Up To 14
DDR5 Support Quad Channel (128-bit bus)
Speeds TBD
Wi-Fi 6E Yes
Overclocking Support Y Y Y Y
Available September 2022 October 2022

Using PCIe 5.0 lanes requires a more premium PCB, usually with more layers which allows the tracks to keep signal integrity, but this typically adds cost. The existence of the B650E chipset will enable vendors to use more expensive PCIe 5.0 laning with more modest controller sets, which allow vendors to offset the cost. Ideally, it gives users a broader and more future-proof platform to upgrade with, but without breaking the bank on unnecessary controller sets; users wanting the best controller sets should opt for X670 or X670E.

This ultimately means that AMD will have a mainstream platform that has PCIe 5.0 by default (B650E) and a lower-cost alternative with just PCIe 4.0 lanes to the PEG and M.2 slots. AMD is strongly prodding motherboard vendors to offer at least one PCIe 5.0 M.2 slot for storage on most of their boards, as this is one of the main benefits of AMD’s AM5 platform.

As announced by AMD during its together we advance_PCs event, the Ryzen 7000 processors for desktop will launch on September 27th, with both motherboards from the X670E and X670 chipsets. The motherboards featuring the B650E and B650 chipsets will be available to purchase at a later date in October.

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